Product Marketing Manager - SiC Advanced Packaging

Wolfspeed; Durham (NC); On-site; USD 110,000 - 160,000; Full time

Job summary

Wolfspeed in Durham, NC, is seeking a Product Marketing Manager for SiC advanced packaging to own go-to-market strategy and product positioning for the SiC substrate portfolio in 2.5D and 3D packaging for HPC and AI data center applications. You will translate market and customer requirements into a compelling roadmap, develop launch plans, and collaborate with product management, applications engineering, and ecosystem partners. Domesti

c and global travel is expected.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Marketing, or equivalent; MBA is preferred.
• Strong understanding of wide band-gap materials and SiC technology.
• Excellent communication and storytelling skills to both technical and executive audiences.

Responsibilities

• Own product positioning, messaging, and value propositions for the SiC advanced-packaging portfolio.
• Define go-to-market strategy and launch plans for new SiC packaging products.
• Conduct market sizing, competitive analysis, and use-case prioritization.
• Engage with partners, customers, and foundries to validate requirements and shape demand.
• Build sales enablement assets and train Wolfspeed sales teams and ecosystem partners.

Skills

Product positioning

Market analysis

Storytelling

Executive communication

Negotiation

Education

Electrical Engineering

Materials Science

Marketing

MBA

Job description

## Product Marketing Manager - SiC Advanced PackagingApplylocations: Durham, North Carolinatime type: Full timeposted on: Posted Yesterdayjob requisition id: 26-632As Product Marketing Manager for Advanced Packaging, you will own the go-to-market strategy and product positioning for Wolfspeed's SiC substrate portfolio in 2.5D and 3D packaging for high-performance computing (HPC) and AI data center applications. Building on Wolfspeed's 35+ years of SiC materials leadership and an established set of proven use cases, you will define how we articulate SiC's value — across heat spreaders and carriers, passive and active interposers — to hyperscalers, foundries, OSATs, and EDA ecosystem partners. You will translate deep market and customer requirements into a compelling roadmap and messaging, and work closely with the same partners and customers to shape demand for next-generation architectures. The ideal candidate combines a strong technical grasp of advanced packaging with proven product-marketing, market-analysis, and storytelling skills.*The ideal candidate will be located in the US.***Key Responsibilities*** Own product positioning, messaging, and value propositions for the SiC advanced-packaging portfolio, tailored to hyperscalers, foundries, OSATs, and EDA partners.* Define and maintain the go-to-market strategy and launch plans for new SiC packaging products, interposer specifications, and PDK enhancements, in partnership with product management and applications engineering.* Conduct market sizing, competitive analysis, and use-case prioritization — benchmarking SiC against competitive materials — and proactively identify and champion new SiC applications.* Engage closely with partners, customers, and foundries to validate requirements, shape demand, and co-develop the narrative for next-generation packaging architectures.* Build sales-enablement assets, reference materials, and competitive collateral; support training for Wolfspeed sales teams, foundry partners, and EDA ecosystem players on SiC value and design guidelines.* Develop and deliver thought-leadership content at packaging industry conferences and tradeshows and ecosystem partner workshops.* Feed consolidated customer and market requirements back to product management and R&D to guide the SiC packaging roadmap.**Qualifications*** Bachelor's Degree in Electrical Engineering, Materials Science, Marketing, or equivalent; technical degree with marketing experience (or MBA) preferred.* Deep industry know-how on the requirement side — an insider's understanding of how hyperscalers, foundries, and OSATs specify advanced packages* Strong understanding of wide band-gap materials* Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.* Exceptional negotiation, communication, and executive relationship-building skills.* Willingness to travel globally.* Passion for building breakthrough growth in an emerging, technically complex market.*We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.*