Product Manager

Vinci Sa; Palo Alto (CA); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Competitive compensation

Equity

Benefits

Job summary

Vinci seeks a Product Manager who understands electronics thermal and CFD workflows inside and out. You will be the voice of the domain, bridging customer needs with our AI-driven platform and ensuring our simulation tools solve real physics problems for engineers.

You will collaborate with engineering, AI research, and pre-sales to shape features, validate real-world use cases, and help customers accelerate their simulation pipelines without traditional PM overhead.

Qualifications

• 5–7+ years hands-on experience running thermal, CFD and thermoelastic simulations in electronics/semiconductors.
• Proficient with thermal management and thermoelastic analysis using standard tools.
• Ability to explain engineering workflows and where current tools fall short.

Responsibilities

• Articulate customer simulation workflows and expectations to product, AI research, and engineering teams.
• Map how customers use current tools for thermal/CFD analyses and where they fail.
• Ensure Vinci outputs and UI/UX match engineers' production expectations (ECAD inputs, STEP, etc.).
• Support pre-sales and pilots by speaking with prospects about how Vinci accelerates simulation pipelines.

Skills

Voice of the customer

Domain expertise in electronics therm≈

Tools

Ansys Icepak/Mechanical

Siemens Flotherm

COMSOL Multiphysics

Cadence Celsius

Abaqus

SolidWorks Flow Simulation

SimScale

Altair SimLab Electronics Thermal

Job description

About Vinci

Vinci is building the intelligence layer for hardware engineering. For decades, physics has been one of the biggest constraints on how physical products get designed — not because engineers don't trust it, but because it's been too slow and too expensive to use continuously. Teams make hundreds of design decisions before they ever see high-fidelity physics; by the time the simulation arrives, the design is largely locked.

We change that. Our Foundation Model for Physics makes deterministic physical reasoning available while a design is still evolving, so engineers can make better decisions before the cost of change compounds. Unlike general-purpose AI, our model learns physical behavior from first principles — not from human-generated text or images.

Today, Vinci is deployed on production engineering programs at leading semiconductor companies — the hardest physics problems in modern electronics. Semiconductors are not the limit. They're the proof: our ambition includes everything downstream of the chip, from robots and vehicles to data centers and aircraft.

We're growing fast, and hiring across the company. Joining now means arriving early enough to help shape how Vinci works, not just what it ships.

The Role

We are looking for a Product Manager who knows the daily reality, pain points, and workflows of electronics thermal and design engineers inside and out.

You live and breathe simulation tools used across the electronics industry. You know what thermal and CFD engineers actually care about, where traditional tools excel, and — more importantly — where they break down, stall out, or cause frustration.

In this role, you will serve as our customer proxy and internal domain authority. You will bridge the gap between our customers’ workflows and our product/engineering team.

Note on this role: You do not need to be a traditional "Product Manager" who owns roadmaps, writes feature specs, or shepherds software delivery. Rather, you are the voice of the domain expert—informing our direction, helping us spot upcoming feature needs, and ensuring our AI platform solves real physics problems for real thermal engineers.

What You’ll Do

• Be the Voice of the Customer: Articulate customer simulation workflows, bottlenecks, and expectations to our core product, AI research, and engineering teams.

• Workflow & Capability Benchmarking: Map out how customers use current tools for thermal, CFD, and thermoelastic analysis, and where legacy tools fail or force compromises.

• Validate Real-World Usecases: Ensure Vinci’s outputs, UI/UX flows, and configuration paradigms (e.g., handling complex ECAD/GDSII/STEP inputs, layer stackups, and power maps) match what an engineer expects in production.

• Support Pre-Sales & Pilots: Speak peer-to-peer with prospect simulation leads, speaking fluently about their current setup and demonstrating how Vinci accelerates their simulation pipelines.

What We’re Looking For

• Domain & Application Expertise: 5-7+ years of hands-on experience running thermal, CFD, and thermoelastic simulations – both steady-state and transient – specifically in electronics and semiconductor applications (e.g., advanced packaging/2.5D/3D ICs, BEOL, PCBs, server assemblies, power electronics/EV chargers, or data center cooling). Experience and understanding of how design engineers’ workflows integrate and depend on simulations.

• Physics & Tool Familiarity: Deep working knowledge of thermal management (conduction, dissipation, cooling) and thermoelastic stress/warpage analysis using tools such as:

  • Ansys Icepak / Mechanical

  • Siemens Flotherm

  • COMSOL Multiphysics

  • Cadence Celsius

  • Abaqus

  • SolidWorks Flow Simulation / SimScale / Altair SimLab Electronics Thermal

  • Familiarity with electronic design file formats and geometry inputs (GDSII, OASIS, IPC-2581, ECXML, STEP).

• Articulation: Ability to clearly explain why an engineer sets up a simulation a certain way, what compromises they make with current tools, and where current software workflows fail.

• Curiosity: Eager to help shape groundbreaking software, adapt quickly, and serve as an internal domain authority without needing traditional PM overhead.

Nice-to-Haves

• Experience as an Application Engineer (AE), FAE, or Technical Support Engineer at a major simulation vendor (e.g., Ansys, Siemens EDA, Cadence, Dassault).

• Basic scripting (e.g., in Python)

Why Join Vinci?

• Work on foundational AI technology that fundamentally transforms the hardware engineering landscape.

• Direct impact on product strategy without getting bogged down in corporate PM overhead.

• Competitive compensation, equity, and benefits.