Product Specialist

Vinci; Iowa; On-site; USD 120,000 - 160,000; Full time

Job summary

Vinci is seeking a Product Manager with deep understanding of electronics thermal and CFD simulations to bridge customer workflows with our AI platform.

You will champion the voice of the domain, map how engineers use current tools, and validate that Vinci’s outputs and UI meet real production expectations, including ECAD/GDSII inputs. This role emphasizes impact over traditional PM duties and offers growth in a cutting-edge AI hardware engineering space.

Qualifications

• 5-7+ years of hands-on thermal, CFD, and thermoelastic simulations in electronics/semiconductors.
• Experience with advanced packaging, 2.5D/3D ICs, BEOL, PCBs, and data center cooling.
• Ability to explain why engineers set up simulations and where tools fail.
• Willingness to shape software direction without traditional PM overhead.

Responsibilities

• Be the voice of the customer, articulating workflows and bottlenecks to product and engineering teams.
• Benchmark workflows and capability of current tools for thermal/CFD/thermoelastic analysis.
• Validate outputs, UI/UX, and input handling (ECAD/GDSII/STEP) for production.
• Support pre-sales and pilots by discussing customer setups and benefits.

Skills

Thermal/CFD experience

Electronics background

Communication

Customer proxy

Curiosity

Tools

Ansys Icepak / Mechanical

Siemens Flotherm

COMSOL Multiphysics

Cadence Celsius

Abaqus

SolidWorks Flow Simulation

SimScale

Altair SimLab Electronics Thermal

GDSII

STEP

Job description

About Vinci

Vinci is building the intelligence layer for hardware engineering. For decades, physics has been one of the biggest constraints on how physical products get designed — not because engineers don't trust it, but because it's been too slow and too expensive to use continuously. Teams make hundreds of design decisions before they ever see high-fidelity physics; by the time the simulation arrives, the design is largely locked.

We change that. Our Foundation Model for Physics makes deterministic physical reasoning available while a design is still evolving, so engineers can make better decisions before the cost of change compounds. Unlike general-purpose AI, our model learns physical behavior from first principles - not from human-generated text or images.

Today, Vinci is deployed on production engineering programs at leading semiconductor companies - the hardest physics problems in modern electronics. Semiconductors are not the limit. They’re the proof: our ambition includes everything downstream of the chip, from robots and vehicles to data centers and aircraft.

We’re growing fast, and hiring across the company. Joining now means arriving early enough to help shape how Vinci works, not just what it ships.

The Role

We are looking for a Product Manager who knows the daily reality, pain points, and workflows of electronics thermal and design engineers inside and out.

You live and breathe simulation tools used across the electronics industry. You know what thermal and CFD engineers actually care about, where traditional tools excel, and – more importantly – where they break down, stall out, or cause frustration.

In this role, you will serve as our customer proxy and internal domain authority. You will bridge the gap between our customers’ workflows and our product/engineering team.

Note on this role: You do not need to be a traditional "Product Manager" who owns roadmaps, writes feature specs, or shepherds software delivery. Rather, you are the voice of the domain expert—informing our direction, helping us spot upcoming feature needs, and ensuring our AI platform solves real physics problems for real thermal engineers.

What You’ll Do

• Be the Voice of the Customer: Articulate customer simulation workflows, bottlenecks, and expectations to our core product, AI research, and engineering teams.

• Workflow & Capability Benchmarking: Map out how customers use current tools for thermal, CFD, and thermoelastic analysis, and where legacy tools fail or force compromises.

• Validate Real-World Usecases: Ensure Vinci’s outputs, UI/UX flows, and configuration paradigms (e.g., handling complex ECAD/GDSII/STEP inputs, layer stackups, and power maps) match what an engineer expects in production.

• Support Pre-Sales & Pilots: Speak peer-to-peer with prospect simulation leads, speaking fluently about their current setup and demonstrating how Vinci accelerates their simulation pipelines.

What We’re Looking For

• Domain & Application Expertise: 5-7+ years of hands-on experience running thermal, CFD, and thermoelastic simulations – both steady-state and transient – specifically in electronics and semiconductor applications (e.g., advanced packaging/2.5D/3D ICs, BEOL, PCBs, server assemblies, power electronics/EV chargers, or data center cooling). Experience and understanding of how design engineers’ workflows integrate and depend on simulations.

• Physics & Tool Familiarity: Deep working knowledge of thermal management (conduction, dissipation, cooling) and thermoelastic stress/warpage analysis using tools such as:

  • Ansys Icepak / Mechanical

  • Siemens Flotherm

  • COMSOL Multiphysics

  • Cadence Celsius

  • Abaqus

  • SolidWorks Flow Simulation / SimScale / Altair SimLab Electronics Thermal

  • Familiarity with electronic design file formats and geometry inputs (GDSII, OASIS, IPC-2581, ECXML, STEP).

• Articulation: Ability to clearly explain why an engineer sets up a simulation a certain way, what compromises they make with current tools, and where current software workflows fail.

• Curiosity: Eager to help shape groundbreaking software, adapt quickly, and serve as an internal domain authority without needing traditional PM overhead.

Nice-to-Haves

• Experience as an Application Engineer (AE), FAE, or Technical Support Engineer at a major simulation vendor (e.g., Ansys, Siemens EDA, Cadence, Dassault).

• Basic scripting (e.g., in Python)

Why Join Vinci?

• Work on foundational AI technology that fundamentally transforms the hardware engineering landscape.

• Direct impact on product strategy without getting bogged down in corporate PM overhead.

• Competitive compensation, equity, and benefits.