Process Integration Development Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 115,000 - 163,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Process Integration Development Engineer to perform FIB lamella preparation and TEM characterization on semiconducting nanostructures. The role supports TD and advanced metrology, focusing on imaging, diffraction, and advanced analysis.

The position requires hands-on FIB/TEM experience in industry, strong problem solving, and the ability to work independently or in teams. On-site work is required in Hillsboro.

Qualifications

• Hands-on FIB sample preparation and TEM prep operation in industry.
• Experience in semiconductor process integration and failure analysis.
• Strong communication skills and ability to work independently or in teams.
• Willingness to adapt to changing methods and tools.

Responsibilities

• Perform FIB lamella preparation and TEM characterization.
• Conduct TEM imaging, electron diffraction, and advanced analysis.
• Collaborate with engineering teams to optimize metrology strategies.
• Contribute to continuous improvement in high-volume manufacturing contexts.

Skills

FIB sample preparation

TEM imaging

TEM analysis

Team collaboration

Education

Associate degree

Bachelor's degree

Master's degree

Tools

FIB

TEM

Job description

## Process Integration Development EngineerApply: US, Oregon, Hillsboro: Full time: Posted Today: JR0287348# **Job Details:**## Job Description:At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand.The position will involve daily focus ion beam(FIB) lamella preparation and advanced transmission electron microscopy (TEM) characterization on semiconduction nanostructures using TEM imaging, electron diffraction, strain analysis, EDS and EELS. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes.The Engineer will be responsible for but not limited to:o Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.o Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.o Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel.o Contributes to continuous improvement efforts in high volume manufacturing environments.o Performs other related duties as required or as directed.o Continuous upgrading of skill set; requires an open attitude and skills to learn from## **Qualifications:** Minimum Qualifications: o Associate degree with 8 years of work experience, Bachelor degree with 4 years of work experience or Master degree with 2 years of work experience. The work experience must be hands-on FIB sample preparation / Transmission Electron Microscopy (TEM) prep operation in industry. o Strong track record of experience, innovation and ownership in FIB and TEM area. Preferred qualifications: o Strong communication skills to work effectively with peer and customers. Be able to work both independently and in teams. o Working knowledge and experience of semiconductor process integration.## Job Type:Experienced Hire## Shift:Shift 2 (United States of America)## Primary Location:US, Oregon, Hillsboro## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.