Process Integration Engineer – Semiconductors & NPI

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Arizona; On-site; USD 110,000 - 170,000; Full time

Job summary

TSMC Arizona is seeking a Process Integration Engineer (PIE) to drive NPI, device performance, yield and reliability across our leading-edge fabs. You will collaborate with device, product engineering, lithography, etch and thin‑films process teams to identify integrated process solutions that address customer issues or requests.

Applicants should have a Bachelor's or higher in Electrical Engineering, Materials Science or Physics, and experience guiding silicon process flows through

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science or Physics.
• Experience leading silicon process flow across FEOL, MEOL and BEOL.
• Experience with process shifts and design-rule changes and their impact on yield and reliability.
• Good communication and interpersonal skills.
• Ability to work on cross-functional, geographically dispersed teams.
• Team player who can multitask in a fast-paced environment.

Responsibilities

• Process Integration Engineer for NPI, device performance, yield and reliability.
• Collaborate with device, product engineering, lithography, etch and thin films teams.
• Identify integrated process solutions addressing customer issues.

Skills

Communication

Interpersonal skills

Cross-functional teamwork

Multitasking

Education

Electrical Engineering

Materials Science

Physics

Job description

TSMC Arizona is seeking a Process Integration Engineer (PIE) to drive NPI, device performance, yield and reliability across our leading-edge fabs. You will collaborate with device, product engineering, lithography, etch and thin‑films process teams to identify integrated process solutions that address customer issues or requests.

Applicants should have a Bachelor's or higher in Electrical Engineering, Materials Science or Physics, and experience guiding silicon process flows through