Process Integration Engineer

Nokia Global; United States; On-site; USD 58,000 - 72,000; Full time

Job summary

Nokia is seeking a Process Integration Engineer to ensure high-quality, reliable InP-based PIC products. You will support a new high-volume fab in San Jose, CA, troubleshoot wafer-fab issues, calculate root causes, and drive yield improvements through data analysis and collaboration with cross-functional teams.

You will work with process engineers to improve stability, maintain specs, and contribute to next-generation PIC platform development.

Qualifications

• At least 2 years of experience in a modern semiconductor fab with strong quality focus.
• Understanding of semiconductor processes and device physics.
• Understanding of statistical process control methods.
• Familiarity with standard semiconductor process technologies (epitaxy, wet/plasma etching, deposition, photolithography).
• Strong focus on quality and attention to detail.
• Eager to learn and expand skill set.
• Strong follow-up skills and problem-solving ability and drive.
• Takes ownership for tasks and projects.
• Team-player with good communication skills (verbal and written).
• Ability to organize data and manage multiple projects and deadlines.

Responsibilities

• Troubleshoot performance and yield issues in the wafer fab.
• Investigate causes for lots on hold and improve yield reliability.
• Support for failure analysis and data-driven investigations.
• Use MES software to collect data and generate reports.
• Review SPC charts and respond to out-of-control events.
• Coordinate movement of qual and development lots through fab, assembly, and test areas.
• Maintain inline FAB process specifications and drive process stability and capability.
• Support Operations to improve throughput and cycle time.
• Contribute to next-generation PIC platform development and ramp activities.

Skills

Semiconductor processes

Device physics

Statistical process control

Quality focus

Problem solving

Ownership

Team player

Communication skills

Data organization

Education

B.S. or higher in Electrical Engineering / Photonics / Physics / Materials Science

Tools

Epitaxy

Wet etching

Plasma etching

Metal deposition

Photolithography

Job description

In the position of Process Integration Engineer, you will ensure high quality and reliability of InP-based Photonic Integrated Circuit (PIC) products through extensive experiments and data analysis. You will have the opportunity to help bring up our new high-volume fab in San Jose, CA. You will work with various functional teams to troubleshoot and improve wafer fabrication processes and drive improvements in yield reliability

Your responsibilities

Your Key Responsibilities:

Troubleshoot challenging performance and yield issues in the wafer fab

Investigate the reason and root cause for lots being put on hold

Provide support for engineers with failure analysis – visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.

Use Manufacturing Engineering System (MES) software to help with integration engineering activities – collect data, perform basic data analysis, generate Power Point reports, etc.

Routine review of SPC charts and initial response for out-of-control events

Coordinate and follow movement of qual and development lots through fab, assembly, and test areas

Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data

Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history

Establish and maintain inline FAB process specifications.

Support Process Engineering to improve process stability and capability

Support Operations to improve throughput and cycle time

Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goals

Help to assurecompliance with PIC product quality system

Your skills and experience

At least2years of experience working in a modern semiconductor fab which places a high premium on quality.

Understanding of semiconductor processes and device physics

Understanding of statistical process control methods

Familiarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography

Strong focuson quality and attention to detail

Eager to learnand expand skill set

Strong follow-up skills and problem-solving ability and drive

Takes ownership for tasks and projects

Team-player with good communication skills, verbal and written

Ability to organize data and keep track of several simultaneous projects and deadlines

Education Required:

B.S. or higher in Electrical Engineering, Photonics, Physics, or Materials Science with at least 2 years of semiconductor fab experience.

At Nokia, we want every candidate to be able to perform their best. If you need any adjustments or support during the recruitment process, please let us know. All requests are treated confidentially.

Job Info

• Job Category Direct Production
• Posting Date 08/03/2026, 12:21 PM
• Job Schedule Full time
• Job Type Experienced
• Job Identification 39059
• Will NSA/CAPS approval be required? (E.g., accessing a US Customer Network?) No
• Laptop - support with ordering needed Yes
• Salary Range $42 to $52 per hour plus incentives
• Experience level Graduate or Entry Level
• Regular or Temporary Regular

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