Process Engineer II, Dry Etch — Wafer Fab Innovator

FUJIFILM Holdings America Corporation; Santa Clara (CA); On-site; USD 110,000 - 130,000; Full time

Benefits offered by this job

Generous benefits package

Competitive wages

Dynamic working environment

Job summary

FUJIFILM Dimatix, Inc. is seeking a skilled engineering professional to develop and improve wafer fab processes for inkjet print heads. This role requires a minimum of 5 years of experience, expertise in plasma etching, and strong problem-solving skills. Candidates must possess a relevant Bachelor's degree and have experience in MEMS wafer fabrication. The position offers competitive pay within the range of $110,000 - $130,000 and promotes a collaborative work environment.

Qualifications

• Minimum 5 years relevant experience in process and design engineering work in a MEMS wafer fab.
• Experience required in Plasma Etching, Ash, photo processes, etc.
• Ability to apply advanced mathematical concepts and statistical techniques.

Responsibilities

• Develop and improve wafer fab processes.
• Provide production support engineering for inkjet print heads.
• Reduce costs and improve yield.

Skills

Problem identification

Problem-solving skills

Communication

Statistical process control (SPC)

Mathematical operations

Education

Bachelor's degree in Engineering, Material Science, Chemistry, or Physics

Tools

Wafer metrology tools

Statistical process control (SPC)

Job description

FUJIFILM Dimatix, Inc. is seeking a skilled engineering professional to develop and improve wafer fab processes for inkjet print heads. This role requires a minimum of 5 years of experience, expertise in plasma etching, and strong problem-solving skills. Candidates must possess a relevant Bachelor's degree and have experience in MEMS wafer fabrication. The position offers competitive pay within the range of $110,000 - $130,000 and promotes a collaborative work environment.