Process Engineer I–IV: Plasma Etch & Semiconductor Tech

Hitachi Automotive Systems Americas, Inc.

Hillsboro (OR)

On-site

USD 64,811 - 146,964

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

A leading technology firm in Hillsboro, OR, is seeking a Process Engineer I-IV to manage process engineering development in semiconductor manufacturing. The ideal candidate should possess a relevant degree and be proficient in advanced engineering skills. Responsibilities include project management, collaboration with internal teams, and data analysis. This role offers a competitive salary range and requires onsite work with opportunities for training and travel to Japan.

Qualifications

  • Ability to learn dry etch/RIE at an advanced level.
  • Excellent organizational and adaptability skills.
  • Experience in a cleanroom or Fab environment is preferred.

Responsibilities

  • Perform process engineering development and support tasks.
  • Work on data collection, analysis, and reporting.
  • Interface with internal customers and lead projects.

Skills

Dry etch/RIE knowledge
Engineering analytical skills
Problem-solving skills
Collaboration ability

Education

BS in Chemical Engineering
MS or PhD in relevant field

Tools

Hitachi plasma etch systems
Statistical Process Control (SPC)

Job description

A leading technology firm in Hillsboro, OR, is seeking a Process Engineer I-IV to manage process engineering development in semiconductor manufacturing. The ideal candidate should possess a relevant degree and be proficient in advanced engineering skills. Responsibilities include project management, collaboration with internal teams, and data analysis. This role offers a competitive salary range and requires onsite work with opportunities for training and travel to Japan.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Plasma Etch Process Engineer I — Hybrid Role
Plasma Etch Process Engineer I — Hybrid Role

Hitachi High-Tech America, Inc • Hillsboro (OR)

Hybrid
USD 67,000 - 185,000
Hybrid Process Engineer I - Semiconductor Plasma Etch
Hybrid Process Engineer I - Semiconductor Plasma Etch

Hitachi High-Tech America, Inc. • Hillsboro (OR)

Hybrid
USD 67,000 - 185,000
Process Engineer I - Semiconductor Manufacturing
Process Engineer I - Semiconductor Manufacturing

Ultra Clean Technology • Hillsboro (OR)

On-site
USD 65,000 - 80,000
Plasma Etch Process Engineer — Drive Process Innovation
Plasma Etch Process Engineer — Drive Process Innovation

Tokyo Electron US • City of Albany (NY)

On-site
USD 67,000 - 97,000
Plasma Etch Process Engineer – Optimize Yields & Innovation
Plasma Etch Process Engineer – Optimize Yields & Innovation

Tokyo Electron • City of Albany (NY)

On-site
USD 67,000 - 97,000
Process Engineer-Contract Role
Process Engineer-Contract Role

Tokyo Electron • City of Albany (NY)

On-site
USD 67,000 - 97,000
Field Process Engineer I — Plasma Etch/RIE Specialist
Field Process Engineer I — Plasma Etch/RIE Specialist

Hitachi High-Tech America, Inc • Phoenix (AZ)

Hybrid
USD 66,000 - 92,000
Field Process Engineer II – Semiconductor Equipment
Field Process Engineer II – Semiconductor Equipment

Applied Materials, Inc. • Hillsboro (OR)

On-site
USD 86,000 - 119,000
Field Process Engineer I - Plasma Etch & RIE Specialist
Field Process Engineer I - Plasma Etch & RIE Specialist

Hitachi Automotive Systems Americas, Inc. • Phoenix (AZ)

On-site
USD 66,756 - 91,789
Process Engineer-Contract Role
Process Engineer-Contract Role

Tokyo Electron US • City of Albany (NY)

On-site
USD 67,000 - 97,000
Comprehensive benefits package
Bonus plan eligibility for certain roles