Process Engineer

Mesh

Gardena (CA)

On-site

USD 90,000 - 140,000

Full time

14 days+

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Benefits offered by this job

Stock options
Discretionary bonuses
Medical, vision, dental insurance
Paid parental leave
Flexible PTO
401(k) retirement plan
Relocation assistance to Los Angeles

Job summary

Mesh Optical Technologies in Gardena, CA, is seeking a Process Engineer to own day-to-day operation, uptime, and optimization of packaging and assembly tools on our production floor.

The role includes designing production processes from lab bench through proof of concept to production ramp, monitoring critical parameters, and driving continuous improvement with engineering teams to enhance yield and reliability.

Qualifications

  • Strong troubleshooting skills for high-uptime operation of precision manufacturing tools.
  • Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments.
  • Ability to interpret process documentation, equipment specs and production data.

Responsibilities

  • Own day-to-day operation and uptime of production tools on the production floor.
  • Design production processes from lab bench to production ramp.
  • Monitor and control key process parameters to ensure repeatability.

Skills

Troubleshooting
High-uptime operation
Cross-functional teamwork
Data interpretation

Education

BS/MS in Materials Science or Engineering

Tools

Flip-chip bonding
Wafer processing
Plasma cleaning
Wire bonding

Job description

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.

Keeping our production tools running and our processes stable is what turns engineering designs into product at volume. We are seeking a Process Engineer to own the day-to-day operation, uptime, and optimization of the packaging and assembly tools on our production floor.

RESPONSIBILITIES
  • Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, de-flux tools, automated handlers, dispense tools, and wire bonders
  • Design production processes from the lab bench through proof of concept and production ramp
  • Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs
  • Troubleshoot tool and process issues in real-time, minimizing downtime, and driving fast root-cause resolution
  • Collaborate with engineering teams to stabilize and improve process flows for die attach, bonding, cleaning, and packaging
  • Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction
  • Push process yields above 99.9% and thermal-cycle reliability beyond 1000 cycles
  • Support factory scaling efforts, qualifying new tools and recipes that enhance unit throughput and yield
QUALIFICATIONS
  • B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field
  • Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools
  • Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
  • Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
  • Ability to interpret process documentation, equipment specifications, and production data to drive consistent output
  • Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
  • Willingness to work extended hours and weekends as needed
PREFERRED EXPERIENCE
  • Direct experience qualifying or operating production equipment in a high-volume production environment
  • Knowledge of sub-µm die-bonding, wafer prep, and materials used in advanced packaging
  • Familiarity with statistical process control and root cause analysis methods
  • 2+ years of experience in process development or yield improvement for optical, photonic, or microelectronic devices
COMPENSATION AND BENEFITS:

Pay range:
Process Engineer: $90,000.00 - $140,000.00/per year

Title and base salary are determined on a case by case basis commensurate with experience and merit.

In addition to base salary, compensation for this role includes:

  • Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
  • Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
  • Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
  • 401(k) retirement plan access.
  • Relocation assistance to sunny Los Angeles.
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