Principal TPM: Modular Data Center Manufacturing & Integration

Google LLC; Sunnyvale (CA); On-site; USD 281,000 - 391,000; Full time

Job summary

Google LLC is seeking a Principal TPM for Modular Manufacturing & Industrial Engineering to lead the transformation of data center delivery. You will translate the modular infrastructure strategy into executable manufacturing plans, bridging design, external fabrication, and field execution at scale.

You will drive the end-to-end process—from factory pre-assembly to live deployment—reducing complexity and accelerating time-to-live AI compute across global facilities.

Qualifications

• Requires a bachelor’s degree in engineering or equivalent practical experience.
• 15 years in technical program management, manufacturing engineering, or industrial engineering.
• 10 years applying DFM/A, Lean Manufacturing and process optimization to complex systems.
• 10 years working with external CMs/ODMs or industrial fabricators to stand up assembly/test lines.

Responsibilities

• Formulate and drive multi-year manufacturing and assembly roadmap for modular data centers.
• Deconstruct systems into standardized building blocks and optimize factory pre-assembly.
• Advocate for DFM/A, DFT, and modular interfaces across engineering teams.
• Analyze on-site construction and re-engineer as off-site factory steps.
• Collaborate with external partners to industrialize modular capacity globally.

Skills

Senior level program management

Industrial engineering leadership

Process optimization

DFM/DFT/Lean manufacturing

External CM/ODM collaboration

Education

Bachelor's degree in Industrial/Manufacturing/Mechanical/Electrical/System Engineering or equivalent

Job description

Google LLC is seeking a Principal TPM for Modular Manufacturing & Industrial Engineering to lead the transformation of data center delivery. You will translate the modular infrastructure strategy into executable manufacturing plans, bridging design, external fabrication, and field execution at scale.

You will drive the end-to-end process—from factory pre-assembly to live deployment—reducing complexity and accelerating time-to-live AI compute across global facilities.