Principal Silicon Photonics Thermal Designer | Equity

NVIDIA Corporation; Santa Clara (CA); On-site; USD 232,000 - 368,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA Corporation in California seeks a Principal Thermal Mechanical Photonic Designer to lead thermo-mechanical design of silicon photonic ICs and related packages. You will work with the global circuits team on high‑speed interfaces and photonic integration.

The role requires a PhD with 15+ years in the field, 8+ years in silicon photonics, hands‑on lab experience, and proficiency in Ansys. You will model die‑package interactions, validate thermal performance, and collaborate across

Qualifications

• PhD in Electrical Engineering or Physics with 15+ years in the field.
• 8+ years developing silicon photonics ICs from concept to high-volume manufacturing.
• Experience in optics or photonic systems product development.
• Applied research on Silicon Photonic ICs and Systems.
• Hands-on silicon photonics product experience.
• Proficient in Ansys tools.
• Experience with alignment, fabrication, gluing, and assembly of lasers and interferometers.
• Strong cross-functional collaboration and communication.

Responsibilities

• Design thermal and structural aspects of silicon photonic designs.
• Run stress simulations and improve optical component designs.
• Set up thermal validation experiments and laser performance under stress.
• Model die-package thermo-mechanical interactions.
• Support opto-mechanical system design with leads.
• Predict failures during assembly and reliability tests.

Skills

Silicon photonics experience

Ansys

Cross-functional teamwork

Excellent communication

Self-motivated

Education

PhD in Electrical Engineering or Physics

Tools

Ansys

Laser/Fiber alignment fixtures

Job description

NVIDIA Corporation in California seeks a Principal Thermal Mechanical Photonic Designer to lead thermo-mechanical design of silicon photonic ICs and related packages. You will work with the global circuits team on high‑speed interfaces and photonic integration.

The role requires a PhD with 15+ years in the field, 8+ years in silicon photonics, hands‑on lab experience, and proficiency in Ansys. You will model die‑package interactions, validate thermal performance, and collaborate across