Principal RF Architect

Engtal; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Long‑term funding

Ownership of full RF system architecture

Impactful project exposure

Job summary

A microelectronics organization in Austin, Texas, is seeking a Senior RF Architect. This role involves leading the design and development of RF and mixed-signal microsystems for high-performance communications and radar applications. The ideal candidate holds a PhD or MS in Electrical Engineering and has over 8 years of experience in RF design, alongside strong skills in simulation tools and cross-functional collaboration. This position offers the chance to work on innovative technologies with significant real-world impact.

Qualifications

• 8+ years of hands-on RF/millimeter-wave design and validation experience.
• Deep expertise in S-parameters and on-wafer measurements.
• Proven ability to correlate simulation to measured performance.

Responsibilities

• Architect RF and mixed-signal microsystems for various applications.
• Lead EM and circuit co-simulation.
• Oversee RF testing and characterization.

Skills

RF simulation and EM modeling tools

S-parameters

high-frequency characterization

cross-functional collaboration

Education

PhD or MS in Electrical Engineering, Applied Physics, or related RF/microwave discipline

Tools

HFSS

ADS

AWR

CST

Job description

We’re partnered with a well-funded, mission-driven microelectronics organization building next-generation RF and mixed-signal microsystems through advanced 3D heterogeneous integration and chiplet-based architectures. This team operates at the intersection of defense technology and commercial innovation, developing breakthrough platforms for communications, sensing, AI, and high-performance computing.

They are seeking a Senior RF Architect to lead the system-level design and development of millimeter-wave microsystems within advanced packaging environments.

What You’ll Do

• Architect RF and mixed-signal microsystems across K-band, Ka-band, and W-band for high-performance communications, radar, and sensing applications
• Define RF front-end architectures including LNAs, PAs, mixers, phase shifters, and T/R modules optimized for advanced 3D packaging flows
• Drive RF, thermal, and mechanical co-optimization across heterogeneous multi-die systems
• Lead EM and circuit co-simulation using tools such as HFSS, ADS, AWR, or CST
• Oversee RF testing and characterization at wafer, die, and module levels, including calibration, de-embedding, and automation strategies
• Collaborate with foundry, EDA, and packaging partners to shape next-generation RF integration technologies
• Develop technical documentation and reference designs to accelerate platform adoption

Required Qualifications

• PhD or MS in Electrical Engineering, Applied Physics, or related RF/microwave discipline
• 8+ years of hands‑on RF/millimeter‑wave design and validation experience
• Deep expertise in S-parameters, on‑wafer measurements, and high‑frequency characterization
• Strong proficiency with RF simulation and EM modeling tools
• Experience navigating packaging‑level electromagnetic challenges
• Proven ability to correlate simulation to measured performance
• Ability to work cross‑functionally in fast‑paced R&D environments

Preferred Qualifications

• Antenna‑in‑Package (AiP), SiP, RFIC, or 3D‑stacked RF module experience
• Familiarity with advanced heterogeneous integration workflows
• Exposure to GaN, GaAs, SiGe, or CMOS RF technologies
• Millimeter‑wave publications or patents
• Experience with advanced test environments such as wafer‑level, thermal, or cryogenic characterization

Why This Opportunity

• Long‑term funding and strong institutional backing
• Ownership of full RF system architecture rather than isolated blocks
• Work on next‑generation high‑frequency microsystems with real‑world impact
• Exposure to both defense‑grade and commercial‑scale technologies