Principal Process Engineer Job#5277

TSMC; Phoenix (AZ); On-site; USD 130,000 - 190,000; Full time

Job summary

TSMC Arizona is seeking a Principal Process Engineer to join our on-site team at the Phoenix facility. You will work with device, integration, defect reduction, lithography, etch and thin films groups to drive leading-edge module development and process optimization, achieving atomic-level precision in manufacturing.

The role demands a Master’s or Bachelor’s with substantial experience in semiconductor processes, strong experimental design, data analysis skills, and leadership of junior

Qualifications

• 2 years in semiconductor process engineering.
• 2+ years in at least 2 of: DOE, SPC, or statistical methods for multivariate data.

Responsibilities

• Drive leading-edge integrated module development and improvements.
• Design and execute experiments; interpret data to optimize manufacturing processes.
• Lead process control, SPC implementations, and precision control improvements.
• Collaborate with equipment and material suppliers to close technology gaps.

Skills

DOE

SPC

Metrology

DRAM tech

Process engineering

Leadership

Education

Master’s degree in a related field

Bachelor’s degree with 5 years experience

Job description

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Job Title

Principal Process Engineer #5277

Statement about position/company

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

Principal Process Engineer - Brief Description

Work closely with other innovators in device, integration, defect reduction, lithography, etch and thin films teams to drive leading-edge integrated module development, control, and improvements to resolve issues or specific requests from TSMC’s customers. Lead the design and execution of experiments, interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.

Responsibilities

• Apply statistics process control methods to establish and sustain a robust manufacturing process.
• Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality.
• Collaborate effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.

Minimum Qualifications/Requirements

• Must have a Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 3 years of engineering experience.
• Alternatively, company will accept a Bachelor’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 5 years of progressive, post-baccalaureate engineering experience.

Technical Skills

• Must have 2 years of experience with semiconductor process engineering.
• Must have 2 years of experience in at least 2 of the following: Design of Experiment (DOE); statistical process control; or statistical methods for modeling multivariate data sets.
• Must have 2 years of experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
• Must have 2 years of experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD).
• Must have 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians.

Physical Requirements

• Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

Standard Work Hours

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences. Candidates must be able to perform the essential functions of the job with or without a reasonable accommodation. If you need a reasonable accommodation as part of this application process, please contact [e-mail] . Requisition 5277