Process Integration Engineer (Phoenix, AZ On-site)

TSMC; Phoenix (AZ); On-site; USD 110,000 - 140,000; Full time

Benefits offered by this job

Relocation assistance available

Job summary

TSMC Arizona is seeking a Process Integration Engineer (PIE) to ensure success across the full product lifecycle, including NPI, device performance, and reliability. You will collaborate with device, lithography, etch, and thin films teams to identify integrated solutions for customer issues and requests.

You will participate in design of experiments, analyze big data to pinpoint design weaknesses, and work across FEOL/MEOL/BEOL processes to improve yield and performance.

Qualifications

• Bachelor's or higher degree in Electrical Engineering, Materials Science or Physics.
• Experience in leading the improvement of the silicon process flow including FEOL, MEOL, and BEOL
• Experience with process shifts, changes with design rules and product layout and their impact on yield and reliability.
• Good communication and interpersonal skills.
• Able to work on cross-functional and geographically dispersed teams.

Responsibilities

• New product qualification and technology transfers from a mother fab.
• Big data analysis to identify process weaknesses and tool issues.
• Design, execute, and analyze experiments to improve yield and performance for each product.
• Collaborate with engineering teams to maintain process stability and provide technical solutions.
• Work in a 24/7 high-volume manufacturing environment with rotating shifts.

Skills

Process integration

Semiconductor fabrication

Yield optimization

Data analysis

Cross-functional teamwork

Education

Bachelor's degree in Electrical Engineering

Tools

Python

MATLAB

Excel

Job description

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting‑edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers.

Job Description

• New product qualification and technology transfers from a mother fab.
• Big data analysis to identify process design weaknesses and/or manufacturing tool issues.
• Designing, executing, and analyzing experiments to improve yield and performance for each specific product.
• Collaborating with the engineering teams to maintain process stability and provide technical solutions to customers.
• Scheduled night shifts and weekend on‑call rotations in a 24/7 high‑volume manufacturing environment.

Qualifications

• Bachelor's or higher degree in Electrical Engineering, Material Science or Physics.
• Experience in leading the improvement of the silicon process flow Including front-end-of-line (FEOL), middle-end-of-line (MEOL), and back-end-of-line (BEOL)
• Experience with process shifts, changes with design rules and product layout with individual process steps and their impact on Function Yield, Electrical Test and Product Performance as well as short- and long‑term reliability implications.
• Good communication and interpersonal skills.
• Able to work on cross‑functional and geographically dispersed teams with diverse backgrounds.
• A team player that can multitask and thrive in a very dynamic and fast‑paced environment.

Interpersonal Skills

• Good communication and interpersonal skills that enable you to work on cross‑functional and geographically dispersed teams.
• Able to take initiatives, adapt priorities and responsibilities to support business needs.
• Hands‑on participant with a strong sense of ownership.
• A team player with leadership skills that can multitask and thrive in a very dynamic and fast‑paced environment.
• Goal driven with demonstrated ability of working in a high performing team culture.
• Quick assimilation to new technology.
• Ability to troubleshoot complex problems and to own the efforts to address and resolve root causes.

Shift Expectations

• Standard work hours are Monday through Friday, with rotational shifts including swing shifts from 3:30 PM to 12:00 AM and occasional weekend shifts.

Candidates must be willing and able to work on‑site at our Phoenix Arizona facility.

Work Location : Phoenix, AZ

Travel : May require travel dependent on business needs

Relocation assistance available

TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences.