Principal Process Engineer Job#5277

TSMC; Arizona; On-site; USD 150,000 - 210,000; Full time

Job summary

TSMC seeks a Principal Process Engineer for its Phoenix, AZ fab to drive cutting-edge semiconductor process development and optimization. You will lead experiments, analyze complex data, and implement precision manufacturing improvements with cross-functional teams across lithography, etch, and thin films.

Qualified candidates hold a Master’s or Bachelor’s with extensive post-baccalaureate experience, and have strong DOE/SPC and metrology skills.

Qualifications

• Master’s degree in Chemical, Electrical, Mechanical Engineering, Physics, Chemistry, Materials Science or related field with 3 years engineering exp.
• Bachelor’s degree in same fields with 5 years progressive post-baccalaureate engineering exp.
• 2 years of semiconductor process engineering experience
• 2 years in at least 2 of DOE; SPC; or statistical methods for modeling multivariate data sets
• 2 years of experience in at least 2 of metrology: TEM; SEM; CD-SEM; EDS; FIB; AFM; XRD; Raman; FT-IR
• 2 years of experience in at least 3 of wafer cross section, wafer fabrication, ion transport, DRAM, plasma etching, plasma simulation, thin film deposition, ALD, 3D NAND, CVD, PECVD
• 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians
• Willingness to work on-site at Phoenix, AZ facility

Responsibilities

• Apply statistics process control methods to establish and sustain a robust manufacturing process.
• Supervise installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality.
• Collaborate with equipment and material suppliers to identify technology gaps and devise mitigation and continuous improvement solutions.

Skills

Semiconductor process engineering

DOE & SPC

Multivariate data modeling

Metrology (TEM/SEM)

Wafer process knowledge

Project leadership

Education

Master’s degree in Engineering/Physical Sciences

Bachelor’s degree +5 years experience

Tools

TEM/SEM tooling

CVD/PECVD processes

Job description

Principal Process Engineer #5277

Statement about position/company

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Principal Process Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Principal Process Engineer - Brief Description

Work closely with other innovators in device, integration, defect reduction, lithography, etch and thin films teams to drive leading-edge integrated module development, control, and improvements to resolve issues or specific requests from TSMC’s customers. Lead the design and execution of experiments, interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels.

Responsibilities:

• Apply statistics process control methods to establish and sustain a robust manufacturing process.
• Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality.
• Collaborate effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.

Minimum Qualifications/Requirements:

Education and Work Experience:

• Must have a Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 3 years of engineering experience.
• Alternatively, company will accept a Bachelor’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 5 years of progressive, post-baccalaureate engineering experience.

Technical Skills:

• Must have 2 years of experience with semiconductor process engineering.
• Must have 2 years of experience in at least 2 of the following: Design of Experiment (DOE); statistical process control; or statistical methods for modeling multivariate data sets.
• Must have 2 years of experience in at least 2 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
• Must have 2 years of experience in at least 3 of the following: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD).
• Must have 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians.

Physical Requirements:

• Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

Standard Work Hours:

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.

As a valued member of the TSMC family, we place a significant focus on your health and well-being. When you are at your best—physically, mentally, and financially—our company is at its best. We offer a comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life. This includes a variety of medical, dental, and vision plan offerings you can choose from that best fit you and your family’s needs. Additionally, TSMC provides income-protection programs to financially assist you should you experience an injury or illness, and a 401(k)-retirement savings plan to help you secure your financial future. TSMC also offers competitive paid time-off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences. Candidates must be able to perform the essential functions of the job with or without a reasonable accommodation. If you need a reasonable accommodation as part of this application process, please contact [e-mail]. Requisition 5277