Principal Process Development Engineer

MACOM; Morgan Hill (CA); On-site; USD 100,000 - 180,000; Full time

Benefits offered by this job

RSU eligible

Performance bonuses

Benefits package including health, 401

Job summary

MACOM is seeking a Principal Process Development Engineer to advance backend assembly and package development for RF power products. You will define specs, guide tooling, and collaborate with vendors to qualify equipment across development stages.

The role demands deep knowledge of semiconductor backend processes, reliability standards, and hands-on experience with DoE, FMEA, SPC, and related methods to improve quality and reduce costs in high-volume manufacturing.

Qualifications

• BS/MS in mechanical, material, industrial engineering or related field.
• 8+ years of experience in package and assembly process development (die attach, SMT, Lid attach).
• Hands-on with die bond equipment such as Datacon EVO.
• Strong knowledge of semiconductor backend assembly processes for RF Power Packages.
• Proficient in FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D, and DoE.
• Project management experience with clear documentation and risk mitigation.
• Solid understanding of semiconductor reliability standards and test methods.
• Experience with materials characterization, DOE, reliability standards, and FA techniques.
• Experience in low/medium/high-volume manufacturing for RF Power products.

Responsibilities

• Develop backend assembly and package developments for RF power products.
• Define specifications, guidelines, and develop assembly processes and recipes.
• Mitigate issues across development stages with process/material/equipment decisions.
• Improve existing assembly processes, equipment, and materials for quality and cost savings.
• Design tooling to adapt off-the-shelf equipment for high-volume production.
• Verify and qualify new tooling, machines, and materials in development.
• Collaborate with vendors and internal teams to qualify and bring up equipment.
• Create and review design and equipment process FMEA regularly.
• Provide manufacturing support with troubleshooting and technical solutions.
• Participate in new product introductions with material selection and data review.
• Conduct risk assessments and project reviews; report outcomes to executives.
• Coordinate mechanical reliability tests and root-cause analysis.

Skills

Project management

FMEA/DFMEA/PFMEA

DoE

Reliability testing

Semiconductor backend assembly

Materials characterization

Process development

Die attach/SMT/Lid attach

Risk assessment & mitigation

Education

BS/MS in mechanical, material, industrial Eng or related field

Tools

Datacon EVO

Job description

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. https://www.macom.com/. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Principal Process Development Engineer

Roles and Responsibilities:

• Developing Backend Assembly Process and/or Package Developments for RF Power products
• Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
• Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.
• Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
• Design new customized tooling to adopt off the shelf equipment for our high-volume production.
• Perform verification and qualification activities for new tooling, machine and materials in development projects
• Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.
• Creation, regular review and updating of design & equipment process FMEA
• Technical support on Manufacturing with troubleshooting and providing technical solution
• Participate in new product introduction with material selection, process developments, and data review, as technical expert
• Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
• Coordinate and support initial mechanical reliability test with failure analysis for root cause finding

Job Qualifications:

• BS. MS preferably in mechanical, material, industrial Engineering, Material Engineering, Applied Science, or other relevant qualification
• Minimum 8+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach.
• Must be able to utilize die bond equipment such as Datacon EVO.
• Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
• Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
• Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
• Solid experience and technical understanding in semiconductor reliability standards and test methods
• Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
• Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call [phone] or email [e-mail]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

RSU Eligible

This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM’s discretion, subject to individual and company performance.

Salary Range

The Salary Range for this position is $100,000 – $180,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.

Benefits

This position offers a comprehensive benefits package including but not limited to:

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.