Principal Engineer Advanced Package Technology Development

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 200,000; Full time

Job summary

Micron Technology, Inc. in Boise seeks a Principal Engineer in Advanced Package Technology Development to lead roadmaps and investment decisions, balancing performance, cost, and scalability with deep technical insight.

Based on the Boise campus, you will influence packaging solutions aligned with Micron's objectives, drive collaboration, publish patents, and contribute to long‑term strategic success.

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking processes.
• Experience in DRAM manufacturing and OSAT companies.

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Analyze and understand competitive trends to improve Micron’s competitive edge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.

Skills

Semiconductor advanced packaging

2.5D integration

3D integration

Hybrid bonding

DRAM manufacturing

OSAT experience

Education

Materials Science/Electrical/Chemical/Mechanical Engineering or related field

Tools

Wafer Level Packaging

3D stacking processes

Job description

Job summary

As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies.

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Analyze and understand competitive trends to improve Micron’s competitive edge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.

Minimum Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required).
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required).
• Experience in DRAM manufacturing and OSAT companies (Required).

Preferred Qualifications

• Understanding of DRAM wafer structure and process flows (Highly Preferred).
• Proficient in English, with additional language skills in East Asian languages being highly preferred.
• A passion for innovation demonstrated by patent inventions or published literature!

About Micron/Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers

US Sites/Accommodations

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Compliance

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI/Fraud Alerts

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.