Principal Packaging Engineer

Velaura; Austin (TX); On-site; USD 200,000 - 500,000; Full time

Benefits offered by this job

Equity participation

Performance-based incentives

Comprehensive benefits

Job summary

Velaura is building next-generation compute technology for cloud, edge, and PhysicalAI. Our packaging role leads architecture and development from concept through production, collaborating with silicon, board, thermal, and manufacturing teams to deliver high-performance, manufacturable products.

The ideal candidate has deep experience in advanced semiconductor packaging, package-level SI/PI, and cross-functional optimization to balance performance, cost, and yield.

Qualifications

• Extensive experience in advanced semiconductor packaging for high-performance SoCs.
• Ability to balance performance, cost, and manufacturability across teams.
• Experience with signal integrity, power integrity, thermal, and reliability.

Responsibilities

• Own package architecture from concept through production for Velaura SoCs.
• Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.
• Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches.
• Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.
• Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.
• Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification.
• Work with foundry, assembly, substrate, and test partners to successfully deliver products to production.
• Help define Velaura's long-term packaging roadmap as future products evolve.

Skills

Package design

SI/PI

Multi-die integration

Foundry collaboration

Tools

OSAT coordination

Job description

Role Overview

We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura’s next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.

Responsibilities

• Own package architecture fromconcept through production for Velaura SoCs.
• Partner with architecture and silicon teams to co-optimize package, die, board,and system design for performance, power, cost, and manufacturability.
• Drive package technology selection, including flip-chip, advanced substrates,fan-out, and future multi-die integration approaches.
• Lead package design, bump planning, substrate definition, escape routing, andassembly interactions with OSAT and substrate vendors.
• Own package-level signal integrity and power integrity planning for high-speedinterfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.
• Collaborate on thermal architecture, mechanical integration, reliability, DFM, andqualification.
• Work with foundry, assembly, substrate, and test partners to successfully deliverproducts to production.
• Help define Velaura's long-term packaging roadmap as future products evolve.

Required Qualifications

• Deep experience developing advanced semiconductor packages forhigh-performance SoCs.
• Strong understanding of package architecture, substrate technologies, bumping,assembly flows, and manufacturing.
• Experience co-optimizing package design with silicon, board, SI/PI, thermal, andmechanical teams.
• Hands-on experience with signal integrity, power integrity, thermal, and reliability

considerations in advanced packages.

• Ability to balance technical excellence with cost, yield, manufacturability, andschedule.
• Excellent communication skills and a collaborative, first-principles engineering mindset.

Preferred Qualifications

• Advanced packaging technologies including chiplets, 2.5D integration, siliconbridges, or heterogeneous integration.
• HBM integration and high-bandwidth memory package architecture.
• Advanced process nodes (N3, N2, or beyond).
• Experience working with leading foundries, OSATs, and substrate vendors.
• Experience in an early-stage semiconductor company.

$200,000 - $500,000 a year

Compensation & Benefits

At Velaura, we believe exceptional talent deserves exceptional rewards. Compensationfor this role includes a competitive base salary, performance-based incentives, andequity participation, allowing team members to share in the company’s long-termsuccess.

Your base pay will depend on your skills, qualifications, experience, and location.

In addition to compensation, Velaura offers a comprehensive benefits package that may include medical, dental, and vision coverage; paid time off; flexible work arrangements; professional development opportunities; and other benefits designed to support the well‑being and growth of our team.

Velaura is committed to pay equity and transparency and regularly benchmarks compensation to ensure we remain competitive in the market.

Why Velaura?

Velaura is building next-generation compute technology for cloud, edge, and PhysicalAI. Our solutions will enable robots, autonomous systems, drones, and other intelligentmachines to operate efficiently in the physical world.
This is an opportunity to help build foundational technology at a time when the industry is undergoing fundamental change. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms. If you enjoy solving difficult problems, working across disciplines, and helping shape thefuture of Physical AI, we would love to hear from you.

Equal Employment Opportunity and Accommodations

Velaura is an Equal Opportunity Employer that is committed to inclusion and diversity.Qualified applicants will receive consideration for employment without regard to race,color, religion, national origin, gender, sexual orientation, gender identity, disability orprotected veteran status. We also take affirmative action to offer employment
opportunities to minorities, women, individuals with disabilities, and protected veterans.

Velaura is committed to working with qualified individuals with physical or mentaldisabilities. Applicants who would like to contact us regarding the accessibility of ourwebsite or who need special assistance or a reasonable accommodation for any part ofthe application or hiring process may contact us at: [e-mail]. This contact
information is for accommodation requests only. Evaluation of requests for reasonableaccommodation will be determined on a case-by-case basis.