Senior Optical Engineer

Brightpath Associates LLC; Santa Barbara (CA); On-site; USD 100,000 - 130,000; Full time

Job summary

A leading technology company in Santa Barbara is looking for a Senior Module Engineer to develop and commercialize optical transceiver modules. The ideal candidate will have 5+ years of experience in optical hardware development, a strong background in coherent link systems, and familiarity with design standards. This role offers the opportunity to work with cutting-edge technology in AI data centers.

Qualifications

• 5+ years of experience in optical module or hardware development.
• Strong background in PAM4/coherent link systems, SerDes, TIAs, drivers, and DSPs.
• Hands-on experience with test tools such as BERTs, oscilloscopes, and OSAs.

Responsibilities

• Define hardware architectures for optical transceiver modules.
• Collaborate with the PIC team for optical engine compatibility.
• Optimize optical coupling for performance and manufacturability.
• Manage prototype builds, hands-on bench debugging, and troubleshooting.

Skills

PAM4/coherent link systems

Signal integrity

Thermal modeling

High-speed analysis

Optical packaging

Education

M.S. or Ph.D. in Electrical Engineering, Physics, Optics, or related field

B.S. required

Tools

BERTs

Oscilloscopes

OSAs

Lumerical

HFSS

Job description

Job Title

Senior Module Engineer

Job Type: Full-Time

Education: B.S. required; M.S./Ph.D. preferred in Electrical Engineering, Physics, Optics, or related field

Experience: 5+ years

Company Overview

We are pioneering the next generation of optical communications to unlock faster, more efficient AI data centers. Founded by leading photonics experts from UC Santa Barbara, our groundbreaking link architecture and photonic integrated circuit (PIC) designs enable coherent optical links in data center environments where existing technologies face fundamental performance limits.

Role Overview

As a Senior Module Engineer, you will take a leading role in developing and commercializing our CohZero™ transceiver module platform. You will collaborate closely with cross-functional teams—including photonic integrated circuit (PIC), systems, and test & characterization—to transform our core photonic technology into high-performance production modules.

Key Responsibilities

• Define hardware architectures for next-generation optical transceiver modules.
• Translate system requirements into optical, electrical, and mechanical design specifications.
• Ensure module designs meet reliability, manufacturability, and cost targets.
• Collaborate with the PIC team to ensure optical engine compatibility and integration.
• Optimize optical coupling (attach, lensing, tolerances) for performance and manufacturability.
• Oversee high-speed PCB design, signal integrity, and power integrity for PAM4/coherent links.
• Lead DSP/driver/AFE integration, testing, and validation.
• Perform thermal modeling, heatsink design, and reliability analysis for high-power pluggables.
• Work with test teams to establish and execute optical/electrical test plans (eye diagrams, jitter, TDECQ, etc.).
• Lead system-level validation in switch, router, and AI cluster environments.
• Manage prototype builds, hands-on bench debugging, and troubleshooting.
• Engage with optics, IC, and packaging vendors to qualify components and negotiate specifications.
• Define DFM/DFT strategies including assembly tolerances, test methodologies, and burn-in processes.
• Ensure compliance with MSAs, IEEE/OIF standards, and Telcordia GR-468 reliability requirements.
• Support technical discussions with customers and partners, presenting module performance data and roadmap updates.

Required Qualifications & Skills

• M.S. or Ph.D. in Electrical Engineering, Physics, Optics, or related field (B.S. required).
• 5+ years of experience in optical module or hardware development.
• Strong background in PAM4/coherent link systems, SerDes, TIAs, drivers, and DSPs.
• Proficiency in signal integrity, RF design, and high-speed analysis (eye diagrams, jitter, TDECQ).
• Experience with fiber attach, optical packaging, PCB layout, and co-packaged optics.
• Expertise in thermal modeling, reliability testing, and heatsink design.
• Familiarity with IEEE 802.3, OIF, MSA standards (QSFP, OSFP, COBO, LPO/CPO).
• Hands-on experience with test tools such as BERTs, oscilloscopes, OSAs, and automation platforms.
• Proficient with simulation tools: Lumerical, Zemax, HFSS, ADS, COMSOL, or similar.
• Knowledge of DFM/DFT, Telcordia GR-468, accelerated lifetime testing, and yield optimization.