Principal Microelectronics Architect

TAP Engineering; Bloomington (IN); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Paid Time Off: 15–25 days annually

Retirement Benefits: Up to 15% contribution to 401(k)

Comprehensive Medical Coverage

Tuition Reimbursement: Up to $36,000 annually

Job summary

TAP Engineering is looking for a Principal Microelectronics Architect (SME) to support a government-sponsored microelectronics modernization initiative. The role focuses on providing technical leadership and advancing semiconductor design methodologies.

The ideal candidate will have over 10 years of experience in microelectronics and a strong background in FPGA technologies and silicon IP. This position offers a competitive salary, benefits package, and the chance to influence long-term design strategies.

Qualifications

• 10+ years of experience in microelectronics design, semiconductor development.
• Deep understanding of silicon IP integration and reuse.
• Strong knowledge of semiconductor design processes.

Responsibilities

• Provide technical leadership in microelectronics design.
• Evaluate semiconductor design workflows.
• Facilitate collaboration among stakeholders.

Skills

Microelectronics Design

Semiconductor Development

FPGA Technology

System-on-Chip (SoC) Architecture

Education

Bachelor's Degree in Electrical Engineering, Computer Engineering

Tools

Cadence

Synopsys

Siemens EDA

Job description

Principal Microelectronics Architect (SME)

Remote (U.S.) | Full-Time | Secret Clearance Required

Position: Principal Microelectronics Architect (SME)
Location: Remote (Periodic On-site Support as Needed)
Category: Hardware Engineering / Systems Architecture
Clearance Requirement: U.S. Citizenship Required; Active Secret Clearance
Education Requirement: Bachelor's Degree in Electrical Engineering, Computer Engineering, or related discipline (Master's or PhD preferred)
Experience Requirement: 10+ Years in Microelectronics Design, Semiconductor Development, or IP Architecture

Position Overview

We are seeking an experienced Principal Microelectronics Architect to serve as a Subject Matter Expert (SME) supporting a critical government-sponsored microelectronics modernization initiative. This role will provide technical leadership in the development of a secure, collaborative design environment focused on advancing semiconductor innovation, intellectual property reuse, and next-generation design workflows.

The selected candidate will work within a highly technical team responsible for defining architecture, standards, and governance models that support the development and integration of advanced microelectronics technologies. This position offers the opportunity to influence long-term strategy while working closely with government stakeholders, industry partners, and engineering teams across the semiconductor ecosystem.

The ideal candidate brings deep expertise in microelectronics design, silicon IP, system-on-chip (SoC) architecture, FPGA technologies, and semiconductor design workflows, along with the ability to communicate complex technical concepts to both technical and executive audiences.

Strategic Technical Leadership

• Serve as a trusted technical advisor supporting the development of secure, cloud-enabled microelectronics design environments
• Provide expertise in semiconductor design methodologies, silicon IP reuse, and design ecosystem modernization
• Guide architectural decisions that support long-term scalability, interoperability, and sustainability

Intellectual Property Management & Governance

• Develop and validate standards for managing reusable design IP repositories
• Establish best practices for secure integration and lifecycle management of commercial and government-developed IP assets
• Assess technical risks, licensing considerations, and long‑term sustainability of IP portfolios
• Support governance strategies that promote efficient IP sharing and collaboration

Design Flow & Technology Integration

• Evaluate and optimize semiconductor design workflows across modern engineering environments
• Support the integration of foundry-qualified design flows and advanced packaging technologies
• Promote interoperability across multiple vendors, toolchains, and semiconductor platforms
• Identify opportunities to accelerate development timelines and improve engineering productivity

Technical Assessments & Program Execution

• Conduct technology evaluations and produce technical assessment reports
• Deliver recommendations related to design infrastructure, tool interoperability, and ecosystem scalability
• Support milestone reviews and provide technical briefings to program leadership and stakeholders
• Contribute to strategic roadmaps that support future program growth and modernization efforts

Stakeholder Collaboration

• Coordinate requirements and technical activities across government organizations, industry partners, research institutions, and engineering teams
• Facilitate collaboration among stakeholders focused on semiconductor design, fabrication, packaging, and testing
• Build consensus around standards, processes, and technical direction

Required Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline
• 10+ years of experience in microelectronics design, semiconductor development, FPGA design, or System-on-Chip (SoC) architecture
• Deep understanding of silicon IP development, integration, validation, and reuse methodologies
• Experience evaluating and managing third-party intellectual property within complex hardware environments
• Familiarity with industry-standard Electronic Design Automation (EDA) tools, including:
  • Cadence
  • Synopsys
  • Siemens EDA
• Understanding of cloud-enabled design environments and collaborative engineering workflows
• Strong knowledge of semiconductor design processes and technology development lifecycles
• Exceptional technical writing, documentation, and presentation skills
• Ability to communicate complex technical concepts to both engineering teams and executive leadership
• U.S. Citizenship with the ability to obtain and maintain a Secret security clearance

Preferred Qualifications

• Active Secret clearance or higher preferred
• Experience supporting government-sponsored microelectronics programs
• Familiarity with trusted semiconductor manufacturing and supply chain assurance initiatives
• Experience with advanced packaging technologies and chiplet architectures
• Knowledge of modern semiconductor fabrication processes and foundry ecosystems
• Familiarity with radiation-hardened, high-reliability, or mission‑critical electronics
• Experience supporting collaborative research and development initiatives involving government, industry, and academia
• Knowledge of leading semiconductor foundries and advanced process technologies

Benefits Overview

TAP Engineering offers a comprehensive and highly competitive benefits package designed to support your health, financial well‑being, professional growth, and work‑life balance.

• Paid Time Off: 15–25 days of PTO annually based on tenure, plus 11 paid holidays with no use-it-or-lose-it policy
• Retirement Benefits: Up to a 15% employer contribution to your 401(k) through a combination of company match and profit‑sharing
• Comprehensive Medical Coverage: Employer‑paid medical insurance for employees, with optional enhanced plans and dependent coverage available
• Dental & Vision Insurance: Employer‑paid dental and vision coverage with optional buy‑up plans
• Tuition Reimbursement: Up to $36,000 annually for approved degree programs, certifications, and continuing education opportunities
• Wellness & Employee Support Programs: Employee Assistance Program (EAP), wellness incentives, virtual healthcare services, prescription savings programs, and travel assistance resources
• Additional Employee Perks: Access to employee discount programs and other company-sponsored benefits
• Performance-Based Recognition: Merit increases, performance bonuses, and employee referral bonuses designed to reward contributions and success

Why Join Us?

This is a unique opportunity to help shape the future of microelectronics design and collaboration within a highly visible national-level initiative. You'll work alongside industry and government leaders, influence next-generation design environments, and contribute to the development of technologies that will impact critical systems for years to come.

The role begins with an initial six‑month technical engagement focused on architecture definition, standards development, and technology assessments. Successful completion of Phase 1 is expected to lead to a five‑year follow‑on effort, providing the opportunity to serve as a technical lead for a major microelectronics modernization initiative and help shape its long‑term architecture, standards, and implementation strategy.