Principal FEOL/MOL integration Engineer

TOKYO ELECTRON AMERICA, INC.; City of Albany (NY); On-site; USD 148,319 - 209,425; Full time

Job summary

TOKYO ELECTRON AMERICA, INC. is seeking a Principal FEOL/MOL integration Engineer in Albany. You will act as a senior technical authority, defining new process integration routes and standing up e-test capability from the ground up.

You will coordinate cross-BU programs to align tool and process portfolios for advanced logic and memory devices. The role requires ownership from flow definition through wafer execution, electrical characterization, and data-driven decisions, with emphasis on

Qualifications

• Demonstrated FEOL/MOL process integration experience from flow to wafer execution.
• Hands-on electrical/parametric test design and interpretation (MOSCAP, TLM, Kelvin, Van der Pauw).
• Experience leading cross-functional or cross-BU technical projects.
• Lot management via SIVIEW MM/SM.
• Metrology and analysis tools operation incl. inline CDSEM & cross-sectional SEM.
• DOE/design of experiments for tool/process optimization.
• Strong data-analysis skills (JMP, Excel).
• Excellent verbal and written communication.

Responsibilities

• Serve as principal technical authority for FEOL/MOL integration.
• Define and build new process integration routes across litho, etch, films, wets, CMP for test vehicles.
• Establish and own e-test capability (parametric test structure, PCM design, probe coordination).
• Lead cross-BU projects coordinating roadmaps and deliverables.
• Design, execute, and demonstrate integration solutions on TEL internal vehicles with statistical analysis.

Skills

FEOL/MOL integration

Electrical test/parametric test

Cross-functional projects

Lot management

Metrology/analysis tools

DOE design

Data analysis

Communication skills

Self-management/teamwork

PC proficiency

Education

Master's degree in Electrical Engineering or related field

PhD + 5 years or Bachelor's + 10 years semiconductor experience

Tools

SIVIEW MM/SM

CDSEM

JMP

Quartz PCI

Job description

Job Description Principal FEOL/MOL integration Engineer

Location: Albany, TX

As a Principal Process Integration Engineer within our FEOL/Middle-of-Line process integration organization, you will operate as a senior individual contributor and technical authority for the team. This is a fab-facing role: you will define and stand up new process integration routes, build out electrical test (e-test) capability from the ground up, and serve as the principal technical owner for cross-business-unit (X-BU) programs that bring TEL's tool and process portfolio together on internal test vehicles. You will work closely with TEL's onsite business units (BUs), factories, and ecosystem partners to verify and integrate processes that demonstrate the benefits of TEL technologies for advanced logic and memory devices. Success in this role means owning route architecture end to end - from flow definition through wafer execution, electrical characterization, and data-driven decision-making - and setting the technical standard for the engineers around you.

Responsibilities

• Serve as the principal technical authority for FEOL/MOL integration, driving direction, priorities, and technical quality through hands-on execution and mentorship as a senior individual contributor (no direct reports).
• Define and build new process integration routes across litho, etch, films, wets, and CMP for FEOL/MOL test vehicles, including flow definition, mask/reticle planning, and split strategy.
• Establish and own e-test (electrical test) capability for the team: parametric test structure and PCM design, test chip planning, probe card / test program coordination, wafer-level parametric extraction, and correlation of electrical results back to unit process and integration knobs.
• Lead cross-business-unit (X-BU) projects, coordinating roadmaps, tool capabilities, and deliverables across TEL BUs, factories, and onsite partners to meet current and future customer needs through standard and novel integration flows.
• Design, execute, and demonstrate proposed integration solutions on TEL internal vehicles, including statistical analysis of results.
• Own lot management including process splits, DOEs, metrology setup, and data analysis/evaluation.
• Support internal and external stakeholders in resolving integration and process issues through current and future TEL equipment capability.
• Maintain rigorous quality-control, documentation, and data-integrity practices, and set those standards for the team.

Required & Preferred Skills

• Demonstrated FEOL/MOL process integration experience with a strong track record of building new processing routes from flow definition through wafer execution. * (Required)*
• Hands-on electrical test / parametric test experience - test structure design and interpretation (e.g., MOSCAP, TLM, Kelvin, Van der Pauw, BEOL daisy chains), PCM/wafer-level parametrics, and probe/test-program coordination. * (Strongly preferred / required for the e-test build-out)*
• Experience leading cross-functional or cross-BU technical projects, including planning and scheduling. * (Required)*
• Lot management skills using SIVIEW MM/SM. * (Preferred)*
• Metrology and analysis tool operation, including inline CDSEM and cross-sectional SEM. * (Required)*
• Knowledge of experiment design (DOE) and techniques for tool and process optimization. * (Required)*
• EUV lithography and/or 193i immersion experience. * (Preferred)*
• Strong data-analysis skills; experience with JMP or equivalent statistical software, Excel, and measurement/analysis software (e.g., Quartz PCI). * (Preferred)
• Excellent verbal and written communication, including technical presentations. * (Required)
• Strong self-management, teamwork, collaboration, and problem-solving skills. * (Required)
• Proficiency with personal computer, peripherals, and standard software (MS Windows, MS Office, networking). * (Required)

Typical Education and Experience

• Master's degree in a related science/engineering field — preferably Electrical Engineering, Materials Science/Engineering, Chemical Engineering, Mechanical Engineering, Chemistry, or Physics — with a minimum of 8 years of related semiconductor-industry engineering experience; or PhD with a minimum of 5 years' experience; or Bachelor's degree with a minimum of 10 years' experience.
• Semiconductor integration experience is required; unit-process experience across litho (scanner/track recipe setup and mask installation), etch, films, wets, and/or CMP is beneficial.
• Prior experience as a principal/senior individual contributor or driving multi-stakeholder technical programs is preferred.
• U.S. work authorization is required.

Physical Demands and Work Conditions

This role operates in both an office and a cleanroom/fab setting. Regular hands-on fab work is expected. Candidates must be able to work in a cleanroom environment, including wearing specialized cleanroom attire (gowns, gloves, masks, hairnets) for extended periods and lifting/carrying FOUPs. The role routinely uses standard office equipment and typically involves 4-6 hours per day at a computer, with the remaining time in the cleanroom or lab. The position may require occasionally lifting office products and supplies up to 35 pounds. Candidates should be comfortable working in a highly regulated, meticulous setting where adherence to strict cleanliness and safety protocols is essential.

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affimative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.

Equal Opportunity Employer/Minorities/Females/Disabled/Veterans.

Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full-time regular employees) a comprehensive benefits package and, for certain roles, eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

Salary Ranges $148,319.86 - $209,424.67

Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job‑related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affimative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.

About TEL Since its founding in 1963, TEL has grown into a global organization that engineers, manufactures, sells, and services wafer-processing and semiconductor production equipment (SPE), as well as flat-panel display (FPD) and thin-film photovoltaic (PVE) equipment. As the world market-share leader across several product lines, TEL plays a key role in the evolving global semiconductor industry.