Principal Engineer – RIE Module Engineering

onsemi; Hopewell Junction (NY); On-site; USD 114,000 - 193,700; Full time

Job summary

onsemi is seeking a RIE Module Principal Engineer to provide technical leadership and strategic direction for Reactive Ion Etch manufacturing operations. This role owns module performance across safety, quality, yield, availability, and cost while shaping long-term technology roadmaps.

You will serve as the technical authority for RIE processes, architect control strategies, and lead cross-functional teams to optimize yield, cycle time, and production efficiency.

Qualifications

• Bachelor's Degree in Chemical Engineering, Semiconductor Engineering, or related technical discipline.
• Minimum 10 years of semiconductor manufacturing experience.
• Minimum 7 years in RIE Process Engineering, Equipment Engineering, or Module Engineering roles.
• Demonstrated leadership of large-scale improvement projects.
• Experience supporting high-volume semiconductor manufacturing environments.

Responsibilities

• Serve as the technical authority for RIE process and equipment performance across multiple technologies and toolsets.
• Develop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and quality.
• Architect control strategies utilizing SPC, FDC, APC, and advanced analytics.
• Establish equipment standards, chamber matching strategies, and process control methodologies.
• Lead technical reviews, risk assessments, and technology transfer activities.
• Own module KPIs including: Tool Availability, COUP, Yield, Defectivity, Lot Holds, Cycle Time, Cost Reduction.
• Drive systematic reduction of chronic tool and process issues through structured root-cause analysis.
• Lead recovery efforts for high-impact manufacturing excursions.
• Implement sustainable corrective and preventive actions that prevent recurrence.
• Develop business cases supporting capital investments, upgrades, and productivity projects.
• Influence equipment selection, supplier strategy, and technology roadmaps.
• Assess future manufacturing needs and identify capacity, capability, and reliability gaps.
• Provide recommendations balancing risk, cost, and operational impact.
• Lead cross-functional teams consisting of Process Engineering, Equipment Engineering, Manufacturing, Quality, Facilities, and Product Engineering.
• Represent the module during site leadership reviews, customer audits, and executive presentations.
• Partner with global engineering organizations to deploy best practices and standardize processes.
• Mentor and coach engineers across multiple levels.
• Develop technical competency frameworks and training roadmaps.

Skills

Statistical process control (SPC)

DOE methodology

Fault Detection and Classification (F:

Advanced Process Control (APC)

Yield analysis

Root Cause Analysis

FMEA

Process qualification methodologies

Data analytics capabilities

Education

Bachelor's Degree in Chemical Engineering

Bachelor's Degree in Semiconductor Engineering

Related Technical Discipline

Tools

TEL RIE platforms

Lam Research RIE platforms

Job description

The RIE Module Principal Engineer is responsible for providing technical leadership and strategic direction for Reactive Ion Etch (RIE) manufacturing operations. This role owns module-level performance across safety, quality, yield, availability, cost, and output while driving long-term technology and operational roadmaps.

Responsibilities

• Serve as the technical authority for RIE process and equipment performance across multiple technologies and toolsets.
• Develop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and quality.
• Architect control strategies utilizing SPC, FDC, APC, and advanced analytics.
• Establish equipment standards, chamber matching strategies, and process control methodologies.
• Lead technical reviews, risk assessments, and technology transfer activities.
• Own module KPIs including:
  • Tool Availability, COUP
  • Yield, Defectivity
  • Lot Holds, Cycle Time
  • Cost Reduction
• Drive systematic reduction of chronic tool and process issues through structured root-cause analysis.
• Lead recovery efforts for high-impact manufacturing excursions.
• Implement sustainable corrective and preventive actions that prevent recurrence.
• Develop business cases supporting capital investments, upgrades, and productivity projects.
• Influence equipment selection, supplier strategy, and technology roadmaps.
• Assess future manufacturing needs and identify capacity, capability, and reliability gaps.
• Provide recommendations balancing risk, cost, and operational impact.
• Lead cross-functional teams consisting of Process Engineering, Equipment Engineering, Manufacturing, Quality, Facilities, and Product Engineering.
• Represent the module during site leadership reviews, customer audits, and executive presentations.
• Partner with global engineering organizations to deploy best practices and standardize processes.
• Mentor and coach engineers across multiple levels.
• Develop technical competency frameworks and training roadmaps.

Qualifications

Education

• Bachelor's Degree in one or more of the following:
  • Chemical Engineering
  • Semiconductor Engineering
  • Related Technical Discipline

Experience

• Minimum 10 years of semiconductor manufacturing experience.
• Minimum 7 years in RIE Process Engineering, Equipment Engineering, or Module Engineering roles.
• Demonstrated leadership of large-scale improvement projects.
• Experience supporting high-volume semiconductor manufacturing environments.

Technical Skills

• Deep understanding of plasma etch processes and RIE equipment.
• Expertise in statistical process control (SPC).
• Experience with:
  • DOE methodology
  • Fault Detection and Classification (FDC)
  • Advanced Process Control (APC)
  • Yield analysis
  • Root Cause Analysis
  • FMEA
  • Process qualification methodologies
• Strong data analytics capabilities.

Preferred Qualifications

• Master's Degree or PhD in Engineering or Physical Sciences.
• Experience with TEL and/or Lam Research RIE platforms.
• Experience supporting automotive, power semiconductor, or image sensor technologies.
• Knowledge of chamber matching, endpoint systems, and advanced process control applications.

Base salary range is $114,000-$193,700 exclusive of fringe benefits or potential bonuses. The final pay rate will depend on geographic location, skills, education, experience, and internal equity considerations.

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.