Principal Diffusion Process Development Engineer, DRAM

Micron Technology Inc

Boise (ID)

On-site

USD 100,000 - 140,000

Full time

7 days ago
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Benefits offered by this job

Medical, dental, and vision plans
Paid family leave
Paid time-off and holidays

Job summary

A leading semiconductor company in Boise, ID, is seeking a Principal Diffusion Process Development Engineer to lead the advancement of FEOL diffusion processes for advanced DRAM technologies. The ideal candidate will have a PhD and a strong background in device physics and process scaling. You will drive innovations and collaborate with cross-functional teams to ensure the execution of the latest technologies. A competitive benefits package and a culture that values personal wellbeing and professional growth await the right candidate.

Qualifications

  • PhD with 4+ years of experience in relevant field.
  • Strong background in MOS device behavior.
  • Demonstrated experience scaling processes to manufacturing readiness.

Responsibilities

  • Lead FEOL diffusion and gate oxidation operations in DRAM technology.
  • Develop ultra-thin gate dielectrics focusing on performance and manufacturability.
  • Drive process development from concept through to manufacturing transfer.

Skills

Device physics
Diffusion processes
Oxidation principles
Analytical skills
Communication skills

Education

PhD in Chemical Engineering, Materials Science, Physics, or similar

Tools

TEM
SIMS
XPS
AFM
SEM

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices! This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes.

Key Responsibilities
  • Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology.
  • Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability.
  • Own the interaction between process conditions, materials behavior, and diffusion hardware.
  • Drive process development from concept through integration, pilot qualification, and manufacturing transfer.
  • Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds.
  • Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability.
  • Plan, complete, and analyze built experiments, and clearly detail technical results.
  • Interpret electrical, physical, and materials characterization data to guide development decisions.
  • Work together with process R&D, process integration, device engineering, equipment engineering, and manufacturing.
  • Partner with external suppliers to develop hardware and processes aligned with future technology needs.
  • Generate intellectual property and technical documentation supporting process innovation.
  • Act as a technical subject‑matter expert, supporting engineers who are developing their skills as needed.
Required Qualifications
  • PhD in Chemical Engineering, Materials Science, Chemistry, Physics, Electrical Engineering, or a closely related field with 4+ years of experience.
  • Strong background in device physics, particularly MOS device behavior.
  • Extensive knowledge of diffusion and oxidation principles, including: Thermal processing and reaction kinetics, Dopant behavior and activation, Interface and defect control.
  • Practical experience working with diffusion and oxidation equipment in laboratory or cleanroom settings.Demonstrated experience scaling processes to manufacturing readiness, including SPC and process control.
  • Strong analytical skills and ability to extract insight from complex datasets.
  • Excellent written and verbal communication skills.
Preferred Experience
  • Experience in gate dielectric reduction within advanced DRAM and/or logic technologies.
  • Familiarity with FEOL integration challenges, including variability and reliability considerations.
  • Experience with characterization techniques such as TEM, SIMS, XPS, AFM, SEM, ellipsometry, and electrical measurements.
  • Proven ability to lead technical projects independently and influence cross‑functional teams.
  • Experience working directly with equipment vendors on tool and process development.
What Sets You Apart
  • You take ownership of processes from early development through manufacturing.
  • You apply strong fundamental physics insight alongside practical engineering judgment.
  • You thrive in a collaborative, fast‑paced R&D environment.
  • You are motivated by solving complex problems that enable future memory technologies. This is your chance to be part of a world‑class team and make a significant impact on the future of technology!

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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