Principal Diffusion Process Development Engineer, DRAM

Micron Technology

Boise (ID)

On-site

USD 100,000 - 150,000

Full time

14 days+

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Benefits offered by this job

Medical, dental, and vision plans
Paid family leave
Robust paid time-off program

Job summary

Micron Technology is seeking a Principal Diffusion Process Development Engineer in Boise, ID. This role focuses on leading FEOL diffusion, annealing, and gate oxidation processes for advanced DRAM technology. The ideal candidate will have a PhD in a relevant field and at least 4 years of experience. Responsibilities include developing gate dielectrics and collaborating with various engineering teams. Micron offers a range of benefits including medical, dental, and paid time off. This is a chance to impact the future of technology significantly.

Qualifications

  • PhD in a related field with 4+ years of experience required.
  • Experience working with diffusion and oxidation equipment in laboratory settings.
  • Strong analytical skills to extract insight from complex datasets.

Responsibilities

  • Lead FEOL diffusion and thermal treatment processes.
  • Develop ultra-thin gate dielectrics for advanced DRAM.
  • Drive process development from concept to manufacturing.

Skills

Device physics understanding
Diffusion and oxidation principles
Analytical skills
Communication skills

Education

PhD in Chemical Engineering
Materials Science
Physics

Tools

TEM
XPS
AFM
SEM

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices. This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes.

Key Responsibilities
  • Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology.
  • Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability.
  • Own the interaction between process conditions, materials behavior, and diffusion hardware.
  • Drive process development from concept through integration, pilot qualification, and manufacturing transfer.
  • Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds.
  • Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability.
  • Plan, complete, and analyze built experiments, and clearly detail technical results.
  • Interpret electrical, physical, and materials characterization data to guide development decisions.
  • Work together with process R&D, process integration, device engineering, equipment engineering, and manufacturing.
  • Partner with external suppliers to develop hardware and processes aligned with future technology needs.
  • Generate intellectual property and technical documentation supporting process innovation.
  • Act as a technical subject‑matter expert, supporting engineers who develop their skills as needed.
Required Qualifications
  • PhD in Chemical Engineering, Materials Science, Chemistry, Physics, Electrical Engineering, or a closely related field with 4+ years of experience.
  • Strong background in device physics, particularly MOS device behavior.
  • Extensive knowledge of diffusion and oxidation principles, including thermal processing and reaction kinetics, dopant behavior and activation, interface and defect control.
  • Practical experience working with diffusion and oxidation equipment in laboratory or cleanroom settings.
  • Demonstrated experience scaling processes to manufacturing readiness, including SPC and process control.
  • Strong analytical skills and ability to extract insight from complex datasets.
  • Excellent written and verbal communication skills.
Preferred Experience
  • Experience in gate dielectric reduction within advanced DRAM and/or logic technologies.
  • Familiarity with FEOL integration challenges, including variability and reliability considerations.Experience with characterization techniques such as TEM, SIMS, XPS, AFM, SEM, ellipsometry, and electrical measurements.
  • Proven ability to lead technical projects independently and influence cross‑functional teams.
  • Experience working directly with equipment vendors on tool and process development.
What Sets You Apart
  • You take ownership of processes from early development through manufacturing.
  • You apply strong fundamental physics insight alongside practical engineering judgment.
  • You thrive in a collaborative, fast‑paced R&D environment.
  • You are motivated by solving complex problems that enable future memory technologies. This is your chance to be part of a world‑class team and make a significant impact on the future of technology!
Benefits

Micron offers a full range of medical, dental, and vision plans, along with income protection benefits for illness or injury, paid family leave, and a robust paid time‑off program and holidays. For additional information regarding the benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity Employer

Micron is proud to be an equal‑opportunity workplace and is an affirmative‑action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected‑veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.

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