Principal Design Engineer, HBM

Micron Technology, Inc; Richardson (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Comprehensive health benefits

Affirmative action workplace

Job summary

Micron Technology, Inc in Richardson, Texas is looking for a skilled engineer to manage HBM product design and ensure design health. The ideal candidate will lead silicon/debug strategies, align cross-functional teams, and drive customer satisfaction through effective problem resolution.

Applicants should have strong expertise in HBM architecture, silicon debugging, and a proven ability to lead technical teams. Benefits include a supportive work environment and opportunities for professional growth.

Qualifications

• 8+ years experience with a Bachelor's or 6+ years with a Master's in Electrical/Computer Engineering.
• Deep expertise in HBM/DRAM architecture and high-speed memory interfaces.
• Strong experience in silicon debug and root-cause resolution.

Responsibilities

• Manage design ownership and health for HBM product design.
• Lead root-cause analysis of complex silicon and customer issues.
• Drive alignment and execution across functional teams for issue resolution.

Skills

HBM/DRAM architecture expertise

Silicon debug

System-level analysis

Technical leadership

Automation skills (Python)

Education

Bachelor's or Master's in Electrical/Computer Engineering

Job description

Responsibilities

• Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability.
• Technical Leadership: Define debug strategies, guide cross‑functional teams, and serve as a technical authority in HBM sustaining efforts.
• Silicon & System Debug: Lead root‑cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple domains.
• Cross‑Functional Execution: Drive alignment and execution across DE, PE, TD, and system teams to ensure efficient issue resolution and product delivery.
• Quality & Yield Leadership: Identify systemic issues and lead initiatives to improve yield, reliability, and performance across HBM products.
• Customer Impact: Lead critical customer escalations and system bring‑up support, ensuring timely resolution and high customer satisfaction.
• Forward Influence: Drive feedback into architecture, design, and verification methodologies to improve future HBM product quality and robustness.

Qualifications

• 8+ years (BS) or 6+ years (MS) in Electrical/Computer Engineering or related field.
• Deep expertise in HBM/DRAM architecture and high-speed memory interfaces.
• Strong experience in silicon debug, system-level analysis, and root-cause resolution.
• Proven ability to lead complex technical problems across cross‑functional teams.
• Strong background in digital and/or custom design and verification.

Preferred Qualifications

• Demonstrated ownership of complex silicon/system issues impacting product or customer delivery.
• Experience influencing architecture, design trade-offs, or product decisions.
• Deep understanding of timing, margining, SI/PI, system-level behavior and silicon correlation.
• Experience with DFT, mBIST, and test-mode debug.
• Strong scripting/automation skills (Python).
• Excellent communication skills with ability to drive alignment at senior technical levels.

Benefits and Equal Opportunity Statement

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.