Principal Characterization-Failure Analysis Engineer

black.ai; Milpitas (CA); On-site; USD 165,000 - 200,000; Full time

Job summary

black.ai is looking for a Principal Characterization-Failure Analysis Engineer in Milpitas, California. The role focuses on thermomechanical characterization and failure analysis of sub-assemblies and silicon dies, requiring deep mechanical and thermal engineering knowledge. Ideal candidates will have a Master's degree and over 10 years of experience in opto-mechanical assembly failure analysis. The base pay ranges from $165,000 to $200,000 USD, with higher rates for the Bay Area.

Qualifications

• 10+ years of experience applying engineering principles to debug complex failures.
• Excellent written and verbal communication skills.
• Demonstrated strong analytical and problem-solving skills.

Responsibilities

• Diagnose failures using root cause analysis.
• Perform failure mode and effects analysis (FMEA).
• Process data using tools like Python and MATLAB.
• Manage projects under tight deadlines.

Skills

Root cause analysis

Failure mode and effects analysis (FMEA)

Python

MATLAB

JMP

Mechanical vibrations characterization

Thermography

Mechanical load testing

Education

Master’s degree in Engineering or Applied Physics

Job description

Job Summary

The Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus.

Responsibilities

• Experienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.
• Experienced with failure mode and effects analysis (FMEA).
• Experienced in data processing tools such as Python, MATLAB, and JMP.
• Familiarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.
• Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).
• Characterization experience in mechanical vibrations, thermography, and mechanical load testers.
• Demonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.
• Good team worker and brings in a positive attitude and is always ready to help others.

Experience & Qualifications

• Master’s degree or higher in an applicable engineering discipline, such as Electrical Engineering, Mechanical Engineering, Optical Engineering or Applied Physics.
• 10+ years of experience applying engineering principles to debug complex failure analysis in opto-mechanical assembly process problems.
• Excellent written and verbal communication skills; Self-starter;
• Demonstrated strong analytical and problem-solving skills;
• Ability to provide technical leadership in ambiguous situations;

U.S. Base Pay Range: $165,000 – $200,000 USD. Bay Area Pay Range: $208,000 – $245,000 USD.