Principal Characterization-Failure Analysis Engineer Milpitas, California, United States

Psiquantum; Milpitas (CA); On-site; USD 120,000 - 150,000; Full time

Job summary

PsiQuantum, located in Milpitas, California, is seeking a Principal Characterization-Failure Analysis Engineer. This role involves conducting thermomechanical characterization and failure analysis on silicon systems. The ideal candidate has over 10 years of experience in opto-mechanical assembly, a Master's degree in a relevant field, and strong analytical skills. You will be responsible for diagnosing failures, performing various analyses, and collaborating effectively with team members. Join us to help develop the first useful quantum computers.

Qualifications

• 10+ years of experience debugging complex failure analysis in opto-mechanical assembly processes.
• Ability to manage short deadlines and disciplined work processes.
• Strong analytical and problem-solving abilities.

Responsibilities

• Diagnose failures using root cause analysis tools like fishbone diagram.
• Perform failure mode and effects analysis (FMEA).
• Analyze data using Python, MATLAB, and JMP.

Skills

Root cause analysis tools

Failure mode and effects analysis (FMEA)

Data analysis using Python

Data analysis using MATLAB

Technical leadership

Communication skills

Analytical abilities

Education

Master’s degree or higher in relevant field

Tools

Python

MATLAB

JMP

Job description

Principal Characterization-Failure Analysis Engineer

Milpitas, California, United States

PsiQuantum is building the first useful quantum computers. Founded in 2016, the company focuses on developing million-qubit, fault-tolerant quantum systems using silicon photonics and high-volume semiconductor manufacturing processes.

Our technology offers advantages such as heat resilience, immunity to electromagnetic interference, and compatibility with existing cryogenic cooling and fiber-optic infrastructure.

Job Summary

The Principal Characterization-Failure Analysis Engineer will conduct thermomechanical characterization of sub‑assembly and silicon dies, and perform failure analysis/debug activities. Expertise in mechanical, thermal, packaging, and package‑processing disciplines is required. Knowledge of photonics and electrical engineering is a plus.

Responsibilities

• Diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach.
• Perform failure mode and effects analysis (FMEA).
• Analyze data using Python, MATLAB, and JMP.
• Familiarize with back‑end semiconductor assembly processes, testing methodologies, and equipment including die attach, wire‑bonding, and AOI.
• Work with photonics sub‑assembly, semiconductor packaging, inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).
• Experience in mechanical vibration, thermography, and mechanical load testing.
• Manage short deadlines and follow disciplined work processes in a fast‑paced environment.
• Collaborate effectively with team members, maintain a positive attitude, and support colleagues.

Qualifications

• Master’s degree or higher in Electrical Engineering, Mechanical Engineering, Optical Engineering, Applied Physics, or a related field.
• 10+ years of experience debugging complex failure analysis in opto‑mechanical assembly processes.
• Excellent written and verbal communication skills.
• Strong analytical and problem‑solving abilities.
• Ability to provide technical leadership in ambiguous situations.

EEO Statement

We are an equal opportunity employer and do not discriminate based on race, color, religion, sex, national origin, age, disability, veteran status, or any other protected category.