Principal ASIC Engineer [Mixed-Signal]

Anysilicon; New York (NY); On-site; USD 180,000 - 260,000; Full time

Job summary

Voyant Photonics is seeking a Principal Mixed-Signal ASIC Engineer to lead the development of custom ICs for silicon photonic chips. You will shape the ASIC strategy, drive tapeouts across 130 nm and below, and mentor a small team of designers in a cutting-edge robotics and AI data-center environment.

The role emphasizes low-noise TIAs, mixed-signal design, and collaboration with photonics, FPGA, and digital teams, with a fast track to delivering silicon within 9–12 months.

Qualifications

• 7+ years in analog and mixed-signal IC design
• Led multiple tapeouts from concept to production silicon
• Deep expertise in low-noise analog circuit design (TIAs)
• Knowledge of test plan development for analog ASICs at OSAT partners
• Strong mixed-signal design including ADCs, DACs, bias circuits, PM
• Experience with mature and advanced nodes and interfacing with digital design
• Ability to deliver working silicon within 9–12 months
• Excellent communication and collaboration skills

Responsibilities

• Drive analog tapeouts from concept to production across 130 nm and below
• Design ultra-low-noise TIAs with pA/Hz noise performance
• Develop mixed-signal circuits (amplifiers, ADCs, DACs, PM) interfacing with photonic ICs
• Establish the ASIC development environment by selecting EDA tools and defining design flows
• Collaborate with photonics designers, systems engineers, and FPGA/digital teams
• Provide HDL and architectural input to external digital design partners
• Hire and mentor a small team of analog and digital IC designers

Skills

Analog design

Mixed-signal design

Tapeouts

TIAs

Test plans

ADC/DAC design

Power management

Collaboration

Tools

EDA tools

Job description

Voyant Photonics is seeking a Principal Mixed-Signal ASIC Engineer to lead the development of custom ICs for silicon photonic chips. This role offers a unique opportunity to shape the ASIC strategy and build a team while working on cutting-edge technology for applications in robotics, autonomy, and AI data centers.

Responsibilities

• Drive analog tapeouts from concept to production across various technology nodes (130 nm and below)
• Design ultra-low-noise transimpedance amplifiers (TIAs) with low pA/Hz noise performance
• Develop mixed-signal circuits including amplifiers, ADCs, DACs, and power management blocks interfacing with photonic ICs
• Establish the ASIC development environment by selecting EDA tools, defining design flows, and setting verification standards
• Collaborate with photonics designers, systems engineers, and FPGA/digital design teams for seamless co-design
• Provide HDL and architectural input to external digital design partners
• Hire and mentor a small team of analog and digital IC designers

Qualifications

• 7+ years of experience in analog and mixed-signal IC design with an 80/20 analog-to-digital focus
• Proven track record of leading multiple tapeouts from concept to production silicon
• Deep expertise in low-noise analog circuit design, particularly TIAs or similar precision circuits
• Knowledge of test plan development for analog ASICs at OSAT partners
• Strong understanding of mixed-signal design including ADCs, DACs, bias circuits, and power management
• Experience in both mature nodes and interfacing with advanced node digital design
• Ability to deliver working silicon within 9-12 months
• Excellent communication and collaboration skills

Skills

• Experience with photonic IC co-design or interfacing analog circuits with optical components
• Knowledge of advanced packaging techniques (chiplets, heterogeneous integration, 2.5D/3D)
• Background in design-for-manufacturability
• Understanding of commercial IP ecosystems and license negotiation

Work Email

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