Precision Wafer Fab Tech – Photonics

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 65,000 - 90,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH seeks a Wafer Fab Process Tech to contribute to wafer dicing, scribing, testing, and back-end certification of wafer lots in a semi-automated fab.

The role emphasizes hands-on work with fragile parts, adherence to quality and process conditions, and collaboration with engineering teams on development and production tasks. Responsibilities include chemical handling, photolithography, etch, PECVD, metallization, back grinding, and maintaining lot traceability

Qualifications

• High School Diploma (or GED or High School Equivalence Certificate).
• LEAN OR Six Sigma experience desirable but not required.
• Experience processing group III-V and IV semiconductors.
• Ability to identify, multi-task, and resolve multiple priority issues quickly.
• Ability to approach tasks in a detail-oriented manner.
• Ability to work in teams and collaborate effectively with people in different functions.

Responsibilities

• Daily Operations include Wafer thinning, Metallization, Dicing/Scribing, Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing.
• Wafer fabrication, back end operations and testing of InGaAs and Germanium photodiodes, including other substrate materials.
• Use of a computer for testing and work order entry or quality details.
• Maintaining Lot traceability through back-end operations.
• Manual handling of fragile parts.

Skills

Manual dexterity

Attention to detail

Process safety

Quality control

Cleanroom protocol

MIL-STD

Education

High School Diploma

LEAN or Six Sigma desirable

Job description

GPD Optoelectronics Corp. in Salem, NH seeks a Wafer Fab Process Tech to contribute to wafer dicing, scribing, testing, and back-end certification of wafer lots in a semi-automated fab.

The role emphasizes hands-on work with fragile parts, adherence to quality and process conditions, and collaboration with engineering teams on development and production tasks. Responsibilities include chemical handling, photolithography, etch, PECVD, metallization, back grinding, and maintaining lot traceability