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Teledyne Technologies Incorporated is seeking an assembler to support the build and test of opto‑mechanical and electro‑optical assemblies. You will interpret drawings, assemble subassemblies, and verify sensor functionality using diagnostic tools.
Responsibilities include optical alignment, precision adjustments, troubleshooting with DMMs and other instruments, and thorough documentation to ensure flight‑critical reliability. Prior experience with PCB assembly is preferred.
Teledyne Technologies Incorporated is seeking an assembler to support the build and test of opto‑mechanical and electro‑optical assemblies. You will interpret drawings, assemble subassemblies, and verify sensor functionality using diagnostic tools.
Responsibilities include optical alignment, precision adjustments, troubleshooting with DMMs and other instruments, and thorough documentation to ensure flight‑critical reliability. Prior experience with PCB assembly is preferred.