Postdoc: RF Neuromorphic Circuits & Sensing Hardware

Penn State University; State College (Centre County); On-site; USD 65,000 - 85,000; Full time

Job summary

Penn State University’s Department of Engineering Science and Mechanics invites a postdoctoral researcher to advance RF neuromorphic hardware for sensing, communication and signal processing. The role covers design, fabrication, and experimental demonstration of neuromorphic circuits and devices, including oscillators, amplifiers, mixers, filters, detectors, and adaptive architectures.

The candidate will contribute to device/circuit fabrication, integration, packaging, and high-frequency

Qualifications

• Ph.D. in electrical engineering, electronics engineering, applied physics or closely related field.
• Strong RF/microwave circuit design experience.
• Experience with RF measurement techniques and related equipment.

Responsibilities

• Design, fabrication, and experimental demonstration of neuromorphic RF hardware.
• Develop RF circuits such as oscillators, amplifiers, mixers, filters, detectors.
• Participate in device/circuit fabrication, integration, packaging, and high-frequency characterization.
• Explore connections between emerging devices and RF concepts, analog/in-memory/neuromorphic processing.

Skills

RF/Microwave design

Analog/mixed-signal

Neuromorphic hardware

Emerging devices

RF measurement techniques

Device fabrication

CADENCE

HFSS

COMSOL

Electrical engineering

Education

PhD in electrical engineering

PhD in electronics engineering

PhD in applied physics

Tools

Cadence

ADS

HFSS

COMSOL

Job description

Penn State University’s Department of Engineering Science and Mechanics invites a postdoctoral researcher to advance RF neuromorphic hardware for sensing, communication and signal processing. The role covers design, fabrication, and experimental demonstration of neuromorphic circuits and devices, including oscillators, amplifiers, mixers, filters, detectors, and adaptive architectures.

The candidate will contribute to device/circuit fabrication, integration, packaging, and high-frequency