Physical Failure Analysis Engineer – Glass Substrates

Absolics Inc.; Covington (GA); On-site; USD 70,000 - 115,000; Full time

Job summary

Absolics Inc. is seeking a Physical Failure Analysis Engineer to perform in-depth failure analysis on glass substrates.

The role involves advanced microscopy, spectroscopy, and metallurgy to identify root causes, with a strong electrical engineering background and the ability to work independently and in a team. The ideal candidate will handle sample preparation, image analysis, data interpretation, and reporting, using SEM, FIB, TEM, FTIR, and EDX to characterize failures and to contribute to

Qualifications

• Bachelor's degree in materials science, electrical engineering, or related field.
• Experience with physical failure analysis in semiconductor or electronic contexts is preferred.
• Proficiency with microscopy and analytical tools (FTIR, EDX) is required.

Responsibilities

• Investigate physical failures and defects using advanced microscopy and analytical techniques.
• Prepare samples for analysis (cutting, polishing, coating) while preserving features.
• Use optical and electron microscopes to examine samples at various scales.
• Analyze images to identify defects, fractures, and anomalies.
• Analyze data from analyses to understand failure mechanisms.
• Generate detailed reports of findings, methodologies, and recommendations.
• Perform mechanical and thermal testing as part of failure analysis.
• Prepare documentation of results and collaborate to improve processes.
• Support OQA with analysis results and troubleshooting.

Skills

Analytical thinking

Problem solving

Attention to detail

Communication skills

Education

Bachelor's degree in materials science or electrical engineering

Tools

SEM

FIB

TEM

FTIR

EDX

Optical microscope

Job description

Absolics Inc. is seeking a Physical Failure Analysis Engineer to perform in-depth failure analysis on glass substrates.

The role involves advanced microscopy, spectroscopy, and metallurgy to identify root causes, with a strong electrical engineering background and the ability to work independently and in a team. The ideal candidate will handle sample preparation, image analysis, data interpretation, and reporting, using SEM, FIB, TEM, FTIR, and EDX to characterize failures and to contribute to