Photonics Packaging & Assembly Manager

Darwin Recruitment; Boston (MA); On-site; USD 195,000 - 235,000; Full time

Job summary

Darwin Recruitment seeks a Photonics Packaging & Assembly Manager for the Greater Boston area. You will own backend assembly processes for co-packaged optics and high-density optical engines, driving production scaling.

Lead cross-functional teams in cleanroom operations, process engineering, and reliability, partnering with OSATs and design to ensure robust packaging solutions for AI and HPC data centers.

Qualifications

• 7+ years in optoelectronic packaging or semiconductor backend manufacturing.
• 3+ years in a supervisory or management role.
• Hands-on with die bonders (Finetech, MRSI), epoxy curing, laser welding, optical coupling.
• Strong SPC, Lean, and ISO cleanroom protocols.

Responsibilities

• Manage daily cleanroom assembly operations and process engineering teams.
• Drive DFA/DFA initiatives and transition steps to high-throughput production.
• Collaborate on thermal/mechanical reliability and CTE issues with design teams.
• Establish transfer protocols and quality metrics with OSAT partners.

Skills

Leadership

Process ownership

Lean manufacturing

SPC

Education

B.S./M.S. in Mechanical Engineering / Optical / Electrical

Tools

Finetech die bonder

MRSI die bonder

Job description

Location: Boston / Greater Massachusetts Corridor, MA (On-site)

Base Compensation: $195,000 – $235,000 USD + Equity & Relocation Assistance

Sector: Silicon Photonics Foundry & High-Performance Computing (HPC)

The Opportunity

A high-growth silicon photonics foundry powering next-generation AI clusters and High-Performance Computing (HPC) data centers is hiring a Photonics Packaging & Assembly Manager in the Greater Boston area. Packaging represents the most critical bottleneck in scaling optical interconnects; you will own the backend assembly processes that bring co-packaged optics (CPO) and high-density optical engines into volume production.

Key Responsibilities

• Process & Operations Ownership: Manage daily cleanroom assembly operations and process engineering teams focused on sub-micron active/passive alignment, fiber array attach, flip-chip bonding, and wire bonding.
• Yield & Automation: Drive Design for Manufacturing (DFM) initiatives and transition manual/semi-automated lab assembly steps into high-throughput, automated production lines.
• Thermal & Mechanical Reliability: Collaborate with PIC design and reliability teams to solve coefficient of thermal expansion (CTE) mismatches and ensure Telcordia GR-468 compliance.
• OSAT Management: Establish process transfer protocols and quality metrics with external Outsourced Semiconductor Assembly and Test (OSAT) partners for high-volume scaling.

Qualifications

• B.S. or M.S. in Mechanical Engineering, Materials Science, Electrical Engineering, or Optics.
• 7+ years of experience in optoelectronic packaging, microelectronics assembly, or semiconductor backend manufacturing, with 3+ years in a supervisory or management role.
• Hands-on familiarity with high-precision die bonders (e.g., Finetech, MRSI), epoxy curing kinetics, laser welding, and optical coupling techniques (grating couplers, edge couplers).
• Strong background in Statistical Process Control (SPC), Lean manufacturing, and cleanroom protocols (ISO Class 5-7).