Photomask Dry Etch Engineer

Tekscend Photomask Corp.; Round Rock (TX); On-site; USD 110,000 - 150,000; Full time

Job summary

Tekscend Photomask Corp. seeks a Dry Etch Process Engineer to support plasma-based dry etch processes for photomask manufacturing.

You will define equipment needs, optimize performance, and drive new dry etch tech into production while collaborating with operations and development teams to boost yield and cycle times. The role requires hands-on tool ownership, strong data analysis skills (JMP/Excel/Python), and a track record of defect and variability reduction.

Qualifications

• Bachelor's degree in Electrical, Chemical, Mechanical Engineering, Physics or Chemistry.
• 3+ years in Dry Etch Process Engineering in semiconductor manufacturing or related thesis.
• Strong root‑cause and 8D/DOE experience required.
• Experience with DOE, SPC, recipe management, APC and OCAP tools.

Responsibilities

• Support plasma-based dry etch processes for photomask manufacturing.
• Define equipment requirements and optimize plasma etch performance.
• Drive introduction of new dry etch technologies into production.
• Collaborate with operations and development teams to improve yield and cycle time.

Skills

Root-cause analysis

DOE

Data analysis

Excel

Python

JMP

FMEA

Education

Bachelor's degree in Electrical/ Chemical/ Mechanical Engineering, Physics, or Chemistry

Tools

JMP

Excel

Python

SQL

Job description

Job description:

The Dry Etch Process Engineer will serve as a key technical contributor supporting plasma-based dry etch processes for photomask manufacturing. As part of the etch engineering team, this role is responsible for daily process sustaining, defining equipment requirements, optimizing plasma etch performance, and driving the introduction of new dry etch technologies into production. The engineer will work closely with operations and technical development teams to ensure robust process integration and to continuously improve yield, cycle time, and overall product quality.

Education/Experience Requirements

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, or a related engineering discipline.
• 3+ years of Dry Etch Process Engineering experience in high‑volume semiconductor manufacturing or new grad with advanced degree and semiconductor-related thesis work.
• Strong troubleshooting capability, including root‑cause analysis (5 Whys, Model‑Based Problem Solving) and implementation of corrective and preventive actions (8D).
• Experience in process development and continuous improvement methodologies, such as DOE, statistical data analysis, APC, recipe management, SPC, and OCAP creation.
• Demonstrated success in defect‑reduction, CD‑variability‑reduction, and yield‑improvement initiatives.
• Hands‑on tool ownership experience, including equipment troubleshooting, preventive maintenance optimization, FMEA, and FDC utilization.
• Proficient in data analysis using tools such as JMP and Excel, with basic scripting or coding skills (VBA, JSL, Python, SQL).
• Basic familiarity with surface characterization techniques (e.g., SEM/EDX, AFM/profilometry, ToF-SIMs, XPS, etc.): when to use what technique and how to interpret the data.
• Familiarity with project management tools (e.g., Gantt charts) and the ability to manage multiple priorities simultaneously.
• Excellent verbal and written communication skills, with the ability to interface effectively with personnel at all organizational levels-from equipment operators to senior leadership.
• A self‑starter with strong attention to detail, solid organizational skills, and a collaborative mindset.