PCB Process Engineer — Prototyping & Space Tech Leader

Johns Hopkins Applied Physics Laboratory; Laurel (MD); On-site; USD 85,000 - 195,000; Full time

Job summary

Johns Hopkins Applied Physics Laboratory is seeking a Process Engineer for Printed Circuit Board Manufacturing to lead the PCB fabrication section. You will drive the long‑term vision, manage capital equipment, and guide a team in a low‑volume, high‑mix environment supporting prototypes and space/defense programs.

You will directly influence fabrication processes, collaborate with equipment vendors, and mentor staff while maintaining high standards of quality and on‑time delivery for critical

Qualifications

• Bachelor's Degree in Chemistry, Chemical Engineering, Manufacturing Engineering, or a similar scientific or engineering discipline, or equivalent work experience.
• 3+ years of relevant experience in PCB processing, equipment, chemistries, or a closely related discipline.
• Experience with industry specifications for rigid and rigid‑flex circuits, IPC‑6012, and IPC‑6013 standards is required.
• Proven ability to establish relationships and effectively interact with all levels of staff and management, as well as with internal and external customers.
• Ability to effectively lead a team of technical staff in solving complex problems.
• Excellent written and verbal communication skills.
• Must be able to obtain Secret level security clearance. Eligibility requires U.S. citizenship.

Responsibilities

• Provide technical direction for the future of PCB fabrication, aligning the section's long‑term vision with the Lab's technology roadmap.
• Identify and evaluate capital equipment and develop staff to maintain technical excellence.
• Participate in key technical efforts, identify emerging opportunities and challenges, supervise technical tasks, and ensure timely completion of products.
• Ensure the highest standards of technical excellence and quality on every project.
• Collaborate with equipment suppliers on troubleshooting and maintenance and engage Lab facilities management and engineers to maintain operations.
• Maintain hands‑on involvement in fabrication activities to develop, troubleshoot, qualify, and improve manufacturing processes.
• Perform fabrication tasks including mSAP development, plating processes, lamination, chemical etching, soldermask and silkscreen, via fill, CNC drilling/routing, and laser via processing.
• Ensure equipment and facilities are maintained in operational order and complete maintenance as able.

Skills

Leadership

Communication skills

Relationship building

Mentoring

Problem solving

Security clearance readiness

Education

Bachelor's degree in Chemistry/ Chemical/ Manufacturing Engineering

Advanced degree (MS/PhD)

Tools

PCB fabrication equipment

Job description

Johns Hopkins Applied Physics Laboratory is seeking a Process Engineer for Printed Circuit Board Manufacturing to lead the PCB fabrication section. You will drive the long‑term vision, manage capital equipment, and guide a team in a low‑volume, high‑mix environment supporting prototypes and space/defense programs.

You will directly influence fabrication processes, collaborate with equipment vendors, and mentor staff while maintaining high standards of quality and on‑time delivery for critical