Process Engineer - Printed Circuit Board Manufacturing

The Johns Hopkins University Applied Physics Laboratory; Laurel (MD); On-site; USD 85,000 - 195,000; Full time

Job summary

The Johns Hopkins University Applied Physics Laboratory in Laurel, MD, seeks a Process Engineer - Printed Circuit Board Manufacturing to lead PCB fabrication, drive technical excellence, and contribute to space exploration and national security missions.

You will mentor staff, develop fabrication schedules, manage capital equipment, and collaborate with suppliers to ensure quality across mSAP, plating, lamination, etching, soldermask, silkscreen, via filling, and CNC operations.

Qualifications

• Bachelor's degree or equivalent experience in a scientific/engineering discipline.
• 3+ years of PCB processing experience including chemistries and equipment.
• Experience with IPC 6012/6013 standards and related specifications.

Responsibilities

• Provide technical direction for PCB fabrication aligned with the Lab's Technology Roadmap.
• Identify capital equipment needs and develop staff for technical excellence.
• Lead technical efforts, review tasks, and ensure timely completion of products.
• Maintain high standards of technical excellence and quality on all projects.
• Collaborate with suppliers and internal teams to troubleshoot and sustain operations.
• Hands-on involvement in fabrication activities (mSAP, plating, lamination, etching, soldermask, silkscreen, vias).
• Maintain equipment and facilities in working order.

Skills

PCB processing

Leadership

Team building

Communication

Problem solving

Education

Bachelor's Degree in Chemistry, Chemical Engineering, Manufacturing engineering, or similar

Advanced degree in electrical engineering, manufacturing engineering, or similar

Job description

Do you thrive in a dynamic, high-energy environment?

Are you passionate about building and growing a highly skilled team?

Are you passionate about contributing to Space Exploration and National Security projects and missions?

Would you like join a team that shares knowledge, encourages learning, creativity and career growth?

If so, we 're looking for someone like you to join our team at APL.

We are seeking a Process Engineer - Printed Circuit Board Manufacturing to be a technical leader in the Printed Circuit Board Fabrication Section, a part of the Advanced Electrical Fabrication Group. This is an outstanding opportunity to apply your passion for electronics fabrication toward sophisticated prototypes and one-of-a-kind systems that advance the scientific knowledge of humankind, safeguard our nation's security, and contribute to exploration and research in space.

Responsibilities

• Provide technical direction for the future of printed circuit board fabrication, working closely with the Group's Chief Engineer and the section supervisor to ensure the Section's long-term vision aligns with the Lab's foreseen Technology Roadmap.
• Identify capital equipment and develop staff to maintain technical excellence.
• Participate in key technical efforts to identify emerging opportunities and challenges, review and supervise technical tasks, and ensure timely completion of products.
• Ensure the highest standards of technical excellence and quality are met on every project.
• Collaborate with equipment suppliers on troubleshooting and maintenance, and engage internal Lab facilities management, engineers, and support to maintain operations.
• Maintain hands-on involvement in fabrication activities as required to develop, troubleshoot, qualify, and improve manufacturing processes.
• Perform fabrication tasks including, but not limited to, mSAP development, various plating processes, lamination, chemical etching, soldermask and silkscreen application, via fill, operation of CNC drilling/routing equipment, and laser via processing.
• Ensure equipment and facilities are maintained in operational working order and complete maintenance as able.

Team Responsibilities

• Establish and promote a climate conducive to intellectual curiosity, creativity, innovation, collaboration, growth, productivity, and respect for others.
• Develop and control fabrication schedules and cost estimates.
• Lead and mentor staff, recruit, develop, and retain a team with outstanding technical capabilities, provide professional development mentorship, and ensure assignment of work to staff is consistent with staff development and project needs.
• Communicate often and effectively with staff and customers.
• Support new business activities to expand the scope of the programs within the Research and Exploratory Development Business Area and explore related opportunities in relevant business areas. Support sponsor engagement and concept development, and assist or lead activities to acquire new work for the Group, which may include proposal writing and meetings with potential sponsors.

Special Working Conditions

• Job involves the use of chemistries and maintenance of equipment which could involve lifting up to 50 pounds.

Minimum Qualifications

• Hold a Bachelor's Degree in Chemistry, Chemical Engineering, Manufacturing engineering, or a similar scientific or engineering discipline or equivalent work experience.
• 3+ years of relevant experience in printed circuit board processing, equipment, chemistries or a closely related discipline.
• Experience with industry specifications for rigid and rigid-flex circuits, IPC 6012, and IPC 6013 standards is required.
• Proven ability to establish relationships and effectively interact with all levels of staff and management, as well as with internal and external customers.
• Ability to effectively lead a team of technical staff in solving complex problems.
• Excellent written and verbal communication skills.
• Demonstrated ability to effectively lead a team of professional and support staff, solving complex problems.
• Are able to obtain Secret level security clearance. If selected, you will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.

Advanced Qualifications

• Hold an Advanced degree in electrical engineering, manufacturing engineering, or a similar scientific or engineering discipline.
• Possess 10+ years of previous experience in the PCB industry, with significant hands‑on experience in fabrication.
• Have experience with High Density Interconnect (HDI) fabrication.
• Have experience with facility and equipment specifications review, implementing capital purchase through commissioning and operational verification.

Compensation

Minimum Rate: $85,000 Annually

Maximum Rate: $195,000 Annually

All qualified applicants will receive consideration for employment without regard to race, creed, color, religion, sex, gender identity or expression, sexual orientation, national origin, age, physical or mental disability, genetic information, veteran status, occupation, marital or familial status, political opinion, personal appearance or any other characteristic protected by applicable law. APL is committed to providing reasonable accommodation to individuals of all abilities, including those with disabilities. If you require a reasonable accommodation to participate in any part of the hiring process, please contact [e-mail].