PCB Design Engineer

Pentangle Tech Services | P5 Group; Peoria (IL); On-site; USD 70,000 - 110,000; Full time

Job summary

Pentangle Tech Services | P5 Group in Peoria, IL seeks a PCB design engineer to develop complex boards using Mentor Graphics and Altium, handling schematic capture, layout, and library creation.

The role focuses on high-density, multi-layer PCBs with advanced via structures and strict IPC-A-600 compliance, including DFM/DFT and Gerber releases for fabrication.

You will coordinate with fabrication vendors and contribute to analog, mixed-signal, and RF routing considerations.

Qualifications

• Experience with schematic capture and PCB layout using Mentor Graphics and Altium.
• Experience with component library design.
• Design for IPC standards and manufacturability.
• Knowledge of DMF/DFT and Gerber release for fabrication.

Responsibilities

• Coordinate with PCB fabrication and assembly vendors.
• Conform to IPC-A-600 for design and ASME/ANSI for documentation.
• Design multilayer high-density PCBs with up to 12 layers and multiple via structures.
• Design multi-layer, blind and buried vias with sub-0.5 mm pitch where needed.
• Assist in DMF/DFT processes and Gerber releases for fabrication and assembly.

Skills

PCB design

Schematic capture

RF routing

Analog design

Mixed-signal design

EMC design

High-density design

Via techniques

IPC standards

Vendor coordination

Tools

Mentor Graphics

Altium Designer

Job description

Job Description

• PCB design engineer with expeirence in Schematic Capture and PCB Layout using multiple tools Mentor graphics, Altium, etc
• Component library design experiences
• EMC design consideration, High desity design, Analog and mixed signal, RF signal routing expereince.
• PCB design technologies, PCB layout techniques, electrical schematicc.
• Design for Mechanical contraints and customer specific design contraints and IPC PCB design standards
• DMF and DFT and gerber release for PCB fabrication and assembly.
• Designing multilayer high-density interconnect printed circuits with multiple via structures up to 12 layers.
• Design of multi-lam, blind and buried via, and sub .5mm pitch applications.
• Coordinate with PCB fabrication and assembly assembly vendors
• IPC-A-600 for design and ASME/ANSI for documentation.