Packaging Engineering Intern: Hands-On R&D & Mentoring

Qorvo, Inc.; Town of Florida (NY); On-site; USD 43,000 - 58,000; Full time

Job summary

Qorvo, Inc. in Apopka, FL is offering a Packaging Engineering Internship for college students pursuing a Bachelor’s, Master’s, or PhD. The program provides real work experience, exposure to upper management, and potential full-time opportunities.

You will gain knowledge on Back Grinding, Dicing, and DTR processes, contribute to the advancement of DTR image analysis, and support R&D with hands-on semiconductor assembly activities.

Qualifications

• BS in Mechanical, Chemical, or Electrical Engineering
• Strong analytical thinking and problem-solving skills
• Effective written and verbal communication
• Ability to present ideas clearly and concisely
• Capable of working autonomously and managing tasks

Responsibilities

• Gain knowledge on Back Grinding, Dicing, and DTR processes to assist with R&D and continuous improvement initiatives
• Contribute to the advancement of the DTR image analysis with a programming initiative
• Characterize the small R&D products and processes using solid modeling and laser metrology to enhance the process
• Onsite hands-on learning of semiconductor assembly processes
• Assist with documentation and continuous improvement (A3s and Lean)

Skills

Analytical thinking

Communication skills

Presentation skills

Problem solving

Autonomy

Education

Bachelor's degree in Mechanical, Chemical, or Electrical Engineering

Job description

Qorvo, Inc. in Apopka, FL is offering a Packaging Engineering Internship for college students pursuing a Bachelor’s, Master’s, or PhD. The program provides real work experience, exposure to upper management, and potential full-time opportunities.

You will gain knowledge on Back Grinding, Dicing, and DTR processes, contribute to the advancement of DTR image analysis, and support R&D with hands-on semiconductor assembly activities.