Packaging Engineer Intern: Spring 2027 - Housing Stipend

Printpack Inc; Atlanta (GA); Presencial; USD 25.000 - 39.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Housing stipend

Descripción de la vacante

Printpack is seeking a Packaging Engineer Intern for Spring 2027 (January 2027–June 2027) in Atlanta, GA. You will work with the Technology and Innovation team, design next-generation packaging solutions, and collaborate with Manufacturing, Sales, and Marketing on strategic growth initiatives.

The role reports to a Product Development Manager and offers hands-on project experience with major consumer products brands, plus a housing stipend and competitive compensation.

Formación

• Working toward a Bachelor of Science in Packaging or related technical field.
• GPA of 3.0 or above.

Responsabilidades

• Coordinate and manage specification consolidation, packaging materials performance criteria, sample fabrication, and prototyping.
• Provide support to Manufacturing by implementing standard operating procedures on equipment and supporting development trials.
• Conduct basic research on new technologies.
• Interact with Sales, Marketing, and Technical associates on product platforms and market development initiatives.
• Facilitate Product Development/Marketing innovation sessions by organizing, completing pre-work or research, and following up on actions.

Educación

B.S. in Packaging

Descripción del empleo

Printpack is seeking a Packaging Engineer Intern for Spring 2027 (January 2027–June 2027) in Atlanta, GA. You will work with the Technology and Innovation team, design next-generation packaging solutions, and collaborate with Manufacturing, Sales, and Marketing on strategic growth initiatives.

The role reports to a Product Development Manager and offers hands-on project experience with major consumer products brands, plus a housing stipend and competitive compensation.