Packaging Design & Validation Engineer

Nexthop Systems Inc

Santa Clara (CA)

On-site

USD 90,000 - 130,000

Full time

14 days+
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Job summary

Nexthop Systems Inc in Santa Clara is seeking a Packaging Engineer to drive the design, validation and procurement of product packaging for high-capacity networking systems intended for AI infrastructures.

You will coordinate with HW, mechanical, and supplier labs to develop cost-effective packaging, perform qualification tests, and ensure compliance with industry standards across global shipping environments.

Qualifications

  • Bachelor’s or higher degree in Packaging or Mechanical Engineering.
  • 2–5 years of experience in protective Packaging for telecom or data center product packaging development.

Responsibilities

  • Develop, implement and oversee cost-effective packaging solutions for data center networking products.
  • Partner with packaging vendors, suppliers, and external labs to ensure timely packaging solutions.
  • Develop design, qualify, release and maintain packaging functions and documentation.
  • Perform qualification plans to characterize and validate packaging for products and FRUs with HW teams.
  • Suggest cost optimization ideas and ensure packaging durability and regulatory compliance.
  • Analyze materials for cost, durability, weight and sustainability; adapt packaging to design changes.
  • Validate packaging under simulated shipping conditions to prevent transit damage.
  • Coordinate with manufacturing to align packaging with production capabilities.

Skills

Cross-functional collaboration
Problem-solving mindset
Communication skills
Adaptability

Education

Bachelor’s or higher degree in Packaging or Mechanical Engineering

Tools

Fusion 360
SolidWorks
Arena
Agile

Job description

Nexthop Systems Inc. is seeking a skilled Packaging Engineer to drive the design, validation & procurement of product packaging for our next-generation, high-capacity networking systems for emerging AI infrastructures. In this role, you’ll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.

What You’ll Do
  • Develop, implement and oversee the cost-effective package solutions that ensure data center networking product protection and marketability as per client requirements, and industry standards.
  • Partner with packaging vendors, suppliers, and external labs to have packaging solutions in timely manner.
  • Develop detailed design, develop, qualify, release and maintain packaging functional activities.
  • Qualification plans to characterize and validate packaging solutions for product and it’s FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.)
  • Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations.
  • Adjust or customize packaging in real time to adopt product design changes.
  • Analyse different materials to assess the cost per unit, considering aspects such as durability, weight, sustainability and fragility of the product.
  • Validate the durability of packaging materials by subjecting them to simulated shipping conditions, ensuring they can withstand rough handling and environmental factors such as temperature changes, ultimately preventing product damage during transit.
  • Understand manufacturing plan & process, machinery, and assembly lines to ensure that the packaging design aligns seamlessly with the production capabilities, helping streamline the manufacturing process to improve operational efficiency.
  • Work closely with the cross-functional teams to coordinate cost, schedule and address cross-functional dependencies e.g. HW allocation, SW readiness, shipment etc.
  • Analyze test results, find product and package design issues, log bugs using tracking software, recommend corrective action, drive resolution and verify fixes.
  • Review, edit, and release package design, parts, and documentation.
  • Evaluate technical readiness prior to release to manufacturing.
  • Learn and improve test cost, consistency, and efficiency proactively.
What You Bring
Qualifications:
  • Bachelor’s or higher degree in Packaging or Mechanical Engineering.
  • 2-5 years of experience in protective Packaging for telecom or data center product packaging development.
Technical Skills:
  • Solid understanding of structural dynamic (shock, vibration, drop,etc) and environmental (temperature, humidity, altitude, acoustic) testing for networking
  • Strong knowledge of industry standards e.g. ISTA, FedEX, IEC, ASTM, ISO etc
  • Able to configure various packaging from FRU, single, multipack, pallets and crates for air, sea, rail, and road transportation
  • Ability to perform fragility analysis with boundary scan testing
  • Experience with mechanical and environmental test equipment e.g. shock & vibration table, acoustic, and other packaging tests, etc
  • Familiarity with MDVT, HALT, & NEBS testing is a plus
Hands-On Expertise:
  • CAD tools such as Fusion or SW to design and reviews with vendors or Mechanical design engineers
  • BOM management tools such as Arena or Agile to maintain and release part numbers with adequate details
  • Conducting operational and non-operational dynamic (shock and vibration tests) and environmental tests at external and internal labs
  • Running test using standalone diagnostic or traffic test using OS & traffic generator
  • Designing and procuring test fixtures to start qualification early
Soft Skills:
  • Strong collaboration and communication skills to work effectively across cross-functional teams in a fast-paced environment.
  • A problem-solving mindset with a focus on delivering results while managing technical risks and tradeoffs.
  • Ability to adapt and thrive in a dynamic and innovative environment.
Why Join Nexthop Systems?

At Nexthop, you’ll have the opportunity to design packaging solutions that drive the future of AI infrastructure. Work alongside experts in cutting-edge technologies, contribute to industry-defining projects, and make a tangible impact in the rapidly evolving networking and data center landscape.

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