NPI Quality Engineer - Semiconductor Packaging

Ciena; United States; A distancia; USD 90.000 - 120.000; Jornada completa

Descripción de la vacante

Ciena is seeking a hands-on Manufacturing Quality Engineer to lead NPI, process development, and manufacturing readiness for semiconductor package assembly and high‑reliability electronic products. You will drive quality, yield, and robust processes across internal and external manufacturing partners.

Key focus areas include package assembly processes (SMT, die attach, wire bond, BGA), process control, DOE, and PFMEA, with collaboration across engineering and supplier networks to ensure

Formación

• Bachelor’s degree in Electrical Engineering or related field.
• Hands-on experience supporting semiconductor package assembly processes.
• Experience with NPI, product transfer, process qualification, and manufacturing readiness.
• Experience with SMT, BGA, reflow profiling, dispensing, and underfill.
• Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, and yield improvement.

Responsabilidades

• Lead NPI activities from product transfer to production release.
• Develop and optimize semiconductor package assembly processes.
• Drive BGA characterization and rework qualification.
• Establish PFMEA, Control Plans, process flows, and work instructions.
• Define process controls and CTQ characteristics.
• Lead root cause investigations using 8D, DMAIC, DOE, 5-Why, and statistical tools.
• Support failure analysis with AXI, CT scan, EDX, dye-penetrant, etc.
• Drive yield improvement and defect reduction.
• Manage non-conforming materials and MRB.
• Support supplier quality audits and manufacturing partner qualifications.
• Interface for manufacturing readiness reviews and customer quality escalations.
• Conduct DFM/DFX reviews to reduce risks.

Descripción del empleo

Ciena is seeking a hands-on Manufacturing Quality Engineer to lead NPI, process development, and manufacturing readiness for semiconductor package assembly and high‑reliability electronic products. You will drive quality, yield, and robust processes across internal and external manufacturing partners.

Key focus areas include package assembly processes (SMT, die attach, wire bond, BGA), process control, DOE, and PFMEA, with collaboration across engineering and supplier networks to ensure