NAND Product Development & Yield Engineering Lead

Solidigm Inc.; California (MO); On-site; USD 120,000 - 180,000; Full time

Job summary

Solidigm Inc. is seeking an experienced engineer to lead NAND component test strategy for high‑volume manufacturing, including burn‑in and high‑speed I/O testing.

The role focuses on validating test plans, data review, and cross‑functional collaboration across design, process, and reliability teams. The candidate will analyze test data to drive yield improvements, diagnose failures, and help scale new NAND production through NPI and HVM stages, contributing to Solidigm’s leadership in memory

Qualifications

• Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.
• 5+ years of experience in logic/memory product engineering or test engineering.
• Knowledge of NAND Flash memory technology, including architecture and operation.
• Functional knowledge of burn-in and high speed I/O test platforms and architectures.
• Excellent communication and teamwork abilities, with experience working in a multi-disciplinary engineering environment.
• Proven track record of technical leadership and ability to work independently.

Responsibilities

• Develop, validate, and deploy burn‑in and high‑speed I/O test specifications, methodologies, and test flows for NAND flash components across high‑volume manufacturing platforms.
• Partner closely with test development engineers to ensure robust assessment of test code validation plan, check out data review and tape release plan.
• Communicate key component test information with cross‑functional stakeholders including yield roadmap/projection, test coverage etc
• Analyze component test and manufacturing data to identify yield trends, anomalies, and opportunities for product, process, or test improvement.
• Collaborate with design, process, and reliability teams to troubleshoot complex test issue and optimize test methodologies to improve coverage, efficiency, and cycle time while supporting yield enhancement and failure analysis activities.

Skills

Statistical data analysis

Electrical failure analysis

NAND Flash memory technology

Burn-in testing

High-speed I/O testing

Cross-functional collaboration

Education

Master’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields

Tools

Burn-in test platforms

High-speed test equipment

Job description

Solidigm Inc. is seeking an experienced engineer to lead NAND component test strategy for high‑volume manufacturing, including burn‑in and high‑speed I/O testing.

The role focuses on validating test plans, data review, and cross‑functional collaboration across design, process, and reliability teams. The candidate will analyze test data to drive yield improvements, diagnose failures, and help scale new NAND production through NPI and HVM stages, contributing to Solidigm’s leadership in memory