MTS Lead DRAM Device Engineer

Micron

Boise (ID)

On-site

USD 110,000 - 150,000

Full time

14 days+

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Job summary

Micron in Boise, Idaho, seeks a Lead DRAM Device Engineer to provide technical leadership for device development, characterization, and yield improvement in next-generation memory technologies. You will mentor engineers, drive cross-functional collaboration across Process Integration, Design, Product Engineering, Quality, and Failure Analysis, and help deliver high-impact fab ramps and product quality.

The role requires an MS/PhD in EE or Materials, experience with node introductions, and strong

Qualifications

  • MS/PhD in Electrical or Materials Engineering or related field.
  • Experience with device physics, characterization, and data analysis.
  • Proven ability to lead technical discussions across cross-functional teams.

Responsibilities

  • Lead DRAM device activities and be the primary technical contact.
  • Drive device characterization and electrical data analysis to improve yield and performance.
  • Support new node introductions, technology transfers, and fab ramp activities via RCA and corrective actions.
  • Provide technical direction across Process Integration, Design, Quality, and Failure Analysis.
  • Mentor engineers and promote data-driven problem solving.

Skills

Semiconductor device physics
Device characterization
Electrical data analysis
Statistical analysis
Technical leadership
Cross-functional collaboration

Education

M.S./Ph.D. in Electrical or Materials Engineering
Advanced degree in EE or Materials Engineering

Tools

AI tools
Data analytics software

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Process Integration Device team is at the forefront of bringing next-generation memory solutions from development into high-volume manufacturing. We partner across Process Integration, Design, Product Engineering, Quality, and Failure Analysis to solve complex technical challenges, improve product performance, and enable successful technology transitions. If you are energized by data-driven problem solving and influencing the future of memory technology, we would love to hear from you.

As a Lead DRAM Device Engineer, you will provide technical leadership for device development, characterization, and yield improvement activities that support next-generation DRAM technologies. This role plays a critical part in enabling successful fab ramps, resolving complex device challenges, and driving product quality and performance. You will serve as a key technical resource across cross-functional teams while mentoring engineers and shaping technical strategy.

Responsibilities
  • Lead DRAM device activities and serve as the primary technical point of contact for device engineering initiatives
  • Drive device characterization, electrical data analysis, and issue segmentation to improve yield, performance, and product quality
  • Support new node introductions, technology transfers, and fab ramp activities through root-cause analysis and corrective action leadership
  • Provide technical direction across Process Integration, Product Engineering, Design, Quality, and Failure Analysis teams to resolve high-impact manufacturing challenges
  • Mentor engineers and promote best practices in device analysis, experimentation, and data-driven problem solving
Minimum Qualifications
  • M.S. or Ph.D. in Electrical Engineering, Materials Engineering, or a related field
  • Experience supporting new node introductions, production yield ramps, and/or technology transfer activities
  • Strong knowledge of semiconductor device physics, device characterization, and electrical data analysis
  • Experience with statistical analysis and data-driven problem-solving methodologies
  • Proven ability to lead technical discussions and collaborate effectively across cross-functional teams
Preferred Qualifications
  • Hands-on experience with memory technologies such as DRAM, NAND, or NOR
  • Understanding of memory architecture, array operation, and margin bin analysis
  • Experience leading technical initiatives or mentoring engineers
  • Experience with AI tools and data analytics applications in semiconductor manufacturing
  • Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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