Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology

Micron Technology

Boise (ID)

On-site

USD 90,000 - 120,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical, dental, and vision plans
Robust paid time-off
Paid holidays

Job summary

Micron Technology in Boise, Idaho is looking for an Engineer specializing in DRAM and Advanced DRAM technologies. The ideal candidate will define electrical specifications and analyze memory device performance, working at the forefront of future memory scaling.

This role requires a strong background in semiconductor physics and offers opportunities for collaboration across diverse engineering teams. Micron provides competitive medical, dental, and vision plans, alongside generous paid time-off and development support.

Qualifications

  • MS degree with 5+ years of experience or PhD in Electrical Engineering or Physics.
  • Strong understanding of semiconductor device physics, especially CMOS.
  • Experience in DRAM array characterization and failure analysis.

Responsibilities

  • Define electrical specifications for DRAM and emerging memory technologies.
  • Conduct experiments to optimize device performance.
  • Collaborate with cross-functional teams to implement device insights.

Skills

Semiconductor device physics
Data analysis
Statistical techniques
Electrical Engineering

Education

MS with 5+ years or PhD in related field

Tools

JMP
Python

Job description

Req ID: JR90433

Engineer – DRAM, Advanced DRAM and EM Device/Cell Technology

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are the R&D DRAM Device and Cell Technology Group at Micron, working at the heart of future memory scaling in an industry‑leading 300mm R&D facility. We explore new device concepts, push the limits of DRAM cell performance, and turn deep physics understanding into manufacturable technology. If you enjoy learning fast, solving hard problems, and collaborating across process areas, this team delivers!

In this role, you will play a critical part in defining and validating future DRAM device and cell technologies. As a Device Engineer, you will characterize memory arrays, analyze electrical behavior and failures, and influence process and material decisions that directly impact yield, quality, and performance. Your work will shape the electrical foundation of next‑generation DRAM products.

Responsibilities
  • Define and drive electrical specifications for DRAM, Advanced DRAM and emerging memory technologies, translating product requirements into device-level targets for performance, reliability and scaling.
  • Design, implement, and interpret experiments to optimize cell and access device performance. This includes running materials experiment, developing new integration schemes and defining new characterization methodologies.
  • Develop physical and electrical models (TCAD and compact modeling) to identify performance, yield and reliability limiters, using advanced materials characterization, device physics insight, and statistical data analysis.
  • Create and or improve stress methodologies to evaluate device reliability (e.g., TDDB, leakage, variability, endurance) and establish robust design margins.
  • Analyze array-level behavior using probe, parametric, and backend data to root‑cause variability, optimize distributions, and improve yield, quality, and cost.
  • Collaborate cross‑functionally with process integration, design, and product engineering teams to translate device insights into technology and product improvements, enabling best‑in‑class memory solutions.
Minimum Qualifications
  • MS with 5+ years of industry experience or PhD with hands‑on research in Electrical Engineering, Physics, or related field.
  • Strong expertise in semiconductor device physics including CMOS, diodes, and related devices.
  • Deep knowledge of mainstream memory technologies such as DRAM, NAND, NOR, or SRAM.
  • Experience with DRAM array characterization and failure analysis.
  • Proficiency in data analysis, DOE, and statistical techniques using tools such as JMP or Python.
Preferred Qualifications
  • Strong written and verbal communication skills.
  • Experience working across process integration and circuit or architecture domains.
  • Demonstrated ability to collaborate with multi‑functional engineering teams.
  • Proven problem‑solving skills and ability to communicate technical status to management.
Job Profile(s)

Process Development Engineer - PhD

Relocation Level

TBD

Benefits

Micron offers medical, dental, and vision plans across all locations, robust paid time‑off, paid holidays, and support programs designed to protect income and aid recovery when illness or injury occurs.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Intern - Advanced DRAM Cell/Device Engineer
Intern - Advanced DRAM Cell/Device Engineer

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental and vision plans
Paid time off
Paid holidays
Sr Engineer, Adv DRAM PI
Sr Engineer, Adv DRAM PI

Micron Technology, Inc • Boise (ID)

On-site
USD 90,000 - 130,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
Advanced DRAM Process Integration Engineer
Advanced DRAM Process Integration Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Choice of medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
Staff Engineer, Adv DRAM PI
Staff Engineer, Adv DRAM PI

Micron Technology, Inc • Boise (ID)

On-site
USD 90,000 - 120,000
Medical, dental, and vision plans
Paid time-off program
Paid family leave
Intern - Advanced DRAM Cell/Device Engineer
Intern - Advanced DRAM Cell/Device Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 110,000 - 160,000
New College Grad - Device Engineer, DRAM
New College Grad - Device Engineer, DRAM

Micron Technology, Inc • Boise (ID)

On-site
USD 42,000 - 59,000
Medical plan
Dental plan
Vision plan
+1
DRAM Device & Cell Technology Engineer Boise, Idaho, United States of America Posted a day ago
DRAM Device & Cell Technology Engineer Boise, Idaho, United States of America Posted a day ago

Micron Technology, Inc • Boise (ID)

Hybrid
USD 120,000 - 180,000
Benefits
Sr Engineer, Adv DRAM PI
Sr Engineer, Adv DRAM PI

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 160,000
Medical, dental, and vision plans
Paid time off
Paid family leave
Sr Process Integration Engineer, DRAM
Sr Process Integration Engineer, DRAM

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 90,000 - 120,000
Choice of medical, dental, and vision plans
Robust paid time-off program
Paid family leave
New College Grad - Device Engineer, DRAM
New College Grad - Device Engineer, DRAM

3000 Micron Idaho Semiconductor Manufacturing (Triton) LLC • Boise (ID)

On-site
USD 28,000 - 41,000