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MTS, Interface Pathfinding Hardware Development Engineer
About the Role
Micron's Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3-5 year technology horizon.As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers - driving decisions independently while consulting heavily with other experts across Micron.This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity - including an expanding mandate for AI-enabled engineering leadership across the organization.
What You'll Own
- Characterization Planning - Derive the electrical characterization plan from the architecture specification and SI link budget before RTL freeze, each test case traceable to a specification parameter and success criteria.
- Design-for-Characterization - Author observability and test-access requirements (debug registers, trim exposure, loopback and pattern modes, analog test-mux) into the register map before RTL freeze.
- Measurement Infrastructure - Develop and own the characterization architecture from hardware and test board specifications through to the automated data acquisition framework.
- Measurement Uncertainty - Measure, calibrate, and de-embed characterization hardware to isolate device performance from measurement noise.
- Characterization - Serve as the program's expert across link and timing integrity, power delivery, I/O-ring robustness, environmental corners, and first-silicon bring-up.
- Correlation and Debug - Co-author the per-revision sim-to-silicon correlation report with the SI engineer and lead the debug tiger team when silicon deviates from simulation.
- Tape-Out Readiness - Sign the characterization-readiness items on the tape-out checklist, then author the post-silicon characterization report and the correlation-gap table for the next test chip.
- Equipment Roadmap and Capability Building - Define bench capability against target data rates, represent findings to vendors, standards forums, and management, mentor junior engineers, and contribute to the IP portfolio.
- AI-Enabled Engineering Leadership - Serve as the Interface Pathfinding organization's primary resource for agentic-AI workflow design and deployment. Architect, implement, and document AI-assisted development and characterization pipelines - including characterization plan generation, data analytics, and predictive modeling via sim-to-silicon correlation acceleration. Represent Micron's AI-enabled characterization methodology to external partners, standards bodies, and internal leadership.
What You Bring
- Required - MSEE with 10+ years (or BSEE with 12+ years) in semiconductor characterization or test engineering, including at least one program owned from plan through sign-off
- - High-speed time-domain measurement including Rj/Dj separation and jitter transfer at multi-GT/s rates
- - BERT and pattern generator/analyzer operation for link margining; switch-matrix automation with per-path de-skew
- - Root Cause and Corrective Action through Principal Component Analysis and First-Principles Design of Experiments
- - Instrument automation for characterization across corners and conditions
- - PDN and load-transient measurement; judgment on bench reference-clock and supply-noise realism
- - Development of simulation plans to pre-validate a test approach; design-of-experiments applied to characterization and root cause
- - First silicon bring-up of an internally designed device
- - Frequency-domain fixture de-embedding (VNA S-parameters, 2x-thru or TRL, TDR) correlated to field-solver models
- - Technical representation of the engineering organization to customers or vendors
- - Cross-organizational technical leadership: demonstrated track record of developing methodologies, tools, or frameworks adopted by engineering teams beyond the immedi