Module Engineering - Day Shift 5 or 7

Intel Corporation; Phoenix (AZ); On-site; USD 75,000 - 110,000; Full time

Job summary

Intel Corporation is seeking a Module Engineer for its Foundry Technology Manufacturing unit in Phoenix, AZ. You will develop and optimize assembly processes and equipment for next-generation foundry packaging, applying innovative concepts across engineering, manufacturing, and technology development.

You will design and implement DOE-driven process specs, enhance reliability screening, and drive continuous improvement using statistical methods to support key product milestones.

Qualifications

• Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related STEM field with 1+ years of experience.
• Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related STEM field.
• 6+ months of experience with SPC and/or DOE principles.

Responsibilities

• Design and develop assembly processes and equipment for foundry packaging roadmap and platform technologies.
• Optimize manufacturing efficiency for foundry packages meeting quality, reliability, cost, yield, productivity and manufacturability requirements.
• Define process and equipment specifications using DOE and data analysis; document innovations in technical papers.
• Develop and maintain equipment evaluating silicon and package technologies under simulated field conditions.
• Ensure package designs are manufacturable within foundry process flows and oversee manufacturing processes.

Education

Bachelor's degree in STEM fields with 1+ years experience

Master's degree in STEM fields

Statistical Process Control (SPC)

Design of Experiments (DOE)

Job description

Job Details:

Job Description:

Shift 5: (Day shift compressed work week) 6 AM-6 PM (Sunday-Tuesday and alternating Wednesdays).

Shift 7: (Day shift compressed work week) 6 AM-6 PM (Thursday-Saturday and alternating Wednesdays).

About the Role

Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers.

What You Will Do

• Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies.
• Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
• Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers.
• Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
• Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
• Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards.
• Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
• Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms.
• Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
• Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements.
• Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.

Qualifications:

Minimum Qualifications

• US Citizenship required.
• Bachelor's degree with 1+ years of experiencein one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• -OR-
• Master's degreein Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
• 6+ months of experience withStatistical Process Control (SPC)and/orDesign of Experiments (DOE)principles.

Preferred Qualifications

• Prior experience working in atechnology or semiconductor manufacturing environment.
• Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.

Why Intel Foundry Technology Manufacturing?

Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of customers. You will collaborate with world-class engineers, contribute to cutting-edge technology development, and directly impact the quality and performance of products that power the global technology industry. This is your opportunity to grow your career while helping define the future of foundry manufacturing.

Job Type:

Experienced Hire

Shift:

Shift 5 (United States of America)

Primary Location:

US, Arizona, Phoenix

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veter