Senior Director, Dry Etch Development Engineering

Talanto

Hillsboro, Northern (OR, KY)

Hybrid

USD 248,000 - 351,000

Full time

9 days ago

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Stock bonuses
Health benefits
Competitive pay and vacation

Job summary

Talanto seeks a Senior Director of Dry Etch Development Engineering in Hillsboro, OR to lead a multinational team driving technology development and enablement across wafer processing, assembly, and module repair. You will oversee process performance and scale manufacturing capacity globally.

The role requires a Master’s in Electrical Engineering, 14+ years in semiconductors, and proven leadership in high- tech manufacturing environments, including foundry-like settings and cross-functional

Qualifications

  • Master's degree in Electrical Engineering or technical equivalent.
  • 14 years of relevant semiconductor industry experience.
  • Experience with large multinational manufacturing organizations, preferably in high tech/semiconductor industries.

Responsibilities

  • Lead a team of module development engineers to drive technology development and enablement.
  • Oversee process and equipment performance in manufacturing lines and grow capacity to high-volume production.
  • Partner with cross-functional teams to deliver robust process solutions with cost focus.

Skills

Etch process leadership
Semiconductor process development
Global manufacturing leadership
Factory ramp-ups
Cross-functional collaboration
Sourcing/supply chain innovation
Research and patents

Education

Master's degree in Electrical Engineering

Job description

Senior Director, Dry Etch Development Engineering

Important: if an employer asks you to log into their system via iCloud or Google, send a code, an SMS or Telegram password, run some code, or install software — refuse. These are signs of fraud.

Job Description:

About the Team

is transforming from an Integrated Device Manufacturer (IDM) to a leading foundry service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield improvement, performance optimization, and exceptional customer service delivery. We are responsible for improving process capability for 's technology nodes from initial product qualification to high volume manufacturing.

About the Role

We are seeking a Senior Director, Dry Etch Development Engineering to join our our team within MDCE.

Key Responsibilities:

  • Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities across wafer processing, assembly/test, and module repair factories.
  • Ensures execution of module improvement responsibilities, and oversees process and equipment performance in manufacturing lines. Leads the growth of manufacturing capacity to high-volume production while simultaneously transferring technology to manufacturing sites across the globe.
  • Drives cross-organizational alignment toward process-pathway solutions and partners closely with integration, device, and yield engineering teams to develop robust process solutions that deliver power-performance and area leadership while maintaining focus on technology structural cost.
  • Partners with supplier executive management to identify, nurture, develop, and implement innovative research and industry ideas, helping bring differentiated solutions to production.
  • Coaches and leads engineering teams to reverse engineer and develop repair and improvement opportunities that enhance cost efficiency, output, and yield.
  • Hires, manages, and coaches engineers in advanced technology development, building deep subject matter expertise across the organization while developing long-term strategies for module engineering capabilities to support future requirements.
  • Enables teams to execute through clear goal setting, facilitation of work, accountability, differentiated performance management, and a strong focus on delivering team results.
  • Drives results by inspiring people, role modeling values, developing the capabilities of others, and fostering a productive and collaborative work environment.

Required Skills and Experience

  • Prior senior management experience with large, multinational manufacturing organizations, preferably within high technology, scientific, or semiconductor industries, including specialization in technology development.
  • Strong industry background in semiconductor process development and leadership, with particular expertise in etch processes across multiple dry etch equipment platforms.
  • Experience working with investors and third-party suppliers to optimize and customize solutions that meet manufacturing requirements.
  • Proven engineering leadership at a global scale, including leading major factory ramp-ups and process technology development in high-volume manufacturing environments.
  • Extensive fab start-up experience with a demonstrated technical track record across multiple semiconductor disciplines, including manufacturing engineering, quality and reliability, research and development, and sourcing/supply chain innovation.

Preferred Skills and Experience

  • Substantial technical expertise in areas such as logic technology development, packaging, silicon process technologies, or related fields, supported by a body of research and patents.
  • Demonstrated success in delivering customized solutions within Research and Development and High Volume Manufacturing (HVM) organizations.
  • Previous experience working in a semiconductor foundry environment.
  • Requirements may be obtained through a combination of relevant industry experience, internships, academic coursework, and/or research activities.

Qualifications:

  • Master's degree in Electrical Engineering or a technical equivalent.
  • 14 years of relevant experience in the semiconductor industry

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

US, Arizona, Phoenix, US, California, Santa Clara

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at .

Annual Salary Range for jobs which could be performed in the US: $248,400.00-350,690.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Director, Dry Etch Development Engineering
Senior Director, Dry Etch Development Engineering

Intel Corporation • Phoenix (AZ)

Hybrid
USD 248,000 - 351,000
Senior Director, Dry Etch Development Engineering
Senior Director, Dry Etch Development Engineering

Intel • Hillsboro (OR)

On-site
USD 180,000 - 280,000
Senior Process Integration Development Engineer
Senior Process Integration Development Engineer

Talanto • Phoenix (AZ)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Staff Process Engineer, Dry Etch
Staff Process Engineer, Dry Etch

Intel • Phoenix (AZ)

Hybrid
USD 133,000 - 256,000
Competitive pay
Stock bonuses
Health benefits
+1
Staff Process Engineer, Dry Etch
Staff Process Engineer, Dry Etch

Intel • Hillsboro (OR)

Hybrid
USD 133,000 - 256,000
Competitive pay
Stock bonuses
Health and retirement benefits
Senior Process Integration Development Engineer
Senior Process Integration Development Engineer

Intel • Hillsboro (OR)

Hybrid
USD 134,000 - 255,000
Technology Development Foundry Engineering – Senior Staff Engineer
Technology Development Foundry Engineering – Senior Staff Engineer

Intel Corporation • Phoenix (AZ)

Hybrid
USD 156,000 - 255,000
Stock bonuses
Health benefits
Hybrid work model
+2
Senior Process Integration Development Engineer
Senior Process Integration Development Engineer

Intel • Santa Clara (CA)

Hybrid
USD 134,000 - 255,000
Hybrid work model
Competitive compensation
Senior Process Integration Development Engineer
Senior Process Integration Development Engineer

Intel • Phoenix (AZ)

Hybrid
USD 134,000 - 255,000
Hybrid work model
Stock bonuses
Health benefits
+2
Wet Etch Cleans Technical Manager
Wet Etch Cleans Technical Manager

Intel Corporation • Hillsboro (OR)

On-site
USD 191,000 - 270,000
Competitive pay
Stock bonuses
Health and retirement benefits
+1