Module Development Engineer

Intel; Hillsboro (OR); On-site; USD 115,000 - 163,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel in Hillsboro, Oregon is seeking a Module Development Engineer to lead the design and optimization of complex manufacturing processes, including MHS equipment development, to enable high-volume production.

You will collaborate across Intel's global network to advance semiconductor manufacturing technologies and deliver transformative solutions for customers and products.

Qualifications

• Bachelor's degree in listed fields with 3+ years of relevant experience, or Master's with 2+, or PhD with no prior experience
• Experience in semiconductor processing, process development, or cleanroom environments
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE)
• Experience in wafer-level assembly module engineering or fab process/hardware development

Responsibilities

• Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology.
• Perform pathfinding activities to enable emerging device architectures and support process and hardware development.
• Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation.
• Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs.
• Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output.
• Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation.

Skills

Semiconductor processing

Process development

Cleanroom environments

Statistical methods

Design of Experiments (DOE)

Wafer-level assembly

Education

Bachelor's degree in Materials Science / Mechanical / Electrical / Chemical / Physics / Chemistry / Organic Chemistry / Polymer Engineering

Master's degree in above fields

PhD in above fields

Tools

JMP

Job description

Job Details

Job Description: Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting‑edge semiconductor technologies.

Business group

As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers.

Key Responsibilities

• Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology.


• Perform pathfinding activities to enable emerging device architectures and support process and hardware development.


• Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation.


• Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs.


• Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output.


• Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation.

Behavioral Traits

• Strong problem‑solving skills, adaptability, and ability to manage multiple tasks simultaneously.


• Passionate about advancing Intel's strategic goals and driving meaningful industry advancements.


• Strong collaboration skills to work effectively across multidisciplinary teams.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry, Organic Chemistry, Polymer Engineering, or related fields, with 3+ years of relevant experience OR Master's degree in the above fields with 2+ years of relevant experience OR PhD in the above fields with no prior professional experience required.


• Experience mentioned above should be a combination of the following:
  
  
  
  • Semiconductor processing, process development, or working in cleanroom environments
  
  
  • Proficiency in statistical methods, such as Statistical Process Control (SPC) and Design of Experiments (DOE).
  
  
  • Experience in wafer‑level assembly module engineering or fab process/hardware technology development.
  
  
  
  

Preferred Qualifications

• Familiarity with semiconductor packaging and assembly technologies.


• Troubleshoot complex manufacturing processes and apply structured problem‑solving methods.


• Experience with advanced process control systems and data analysis tools like JMP software.

This is your chance to shape the future of semiconductor technology and make a lasting impact.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00 - 162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on‑site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.