Module Development Defect Inspection Engineer

Intel Corporation

Hillsboro (OR)

On-site

USD 134,000 - 189,000

Full time

6 days ago
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Job summary

Intel in Hillsboro, Oregon, seeks a Module Development Engineer, Defect Inspection, to develop, optimize, and scale defect inspection solutions for current HVM and future nodes. You will collaborate across engineering, suppliers, and research teams to improve inspection capability and drive yield improvements.

The role requires a strong foundation in SPC/DOE, semiconductor processing, and packaging processes with a track record of process improvement and automation.

Qualifications

  • Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience.
  • Master’s degree in the same field with 3+ years of experience and a PhD with 2+ years of experience.

Responsibilities

  • Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
  • Design and optimize processes, inspection methods, and equipment performance.
  • Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC).
  • Collaborate with equipment and materials suppliers to introduce new technologies.
  • Analyze defect data to identify root causes and improve yield and quality.
  • Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
  • Support technology pathfinding and roadmap development for next-generation products.
  • Stay current with industry trends, emerging tools, and inspection methodologies.

Skills

Statistical Process Control (SPC)
Design of Experiments (DOE)
Semiconductor manufacturing knowledge

Education

Bachelor's degree + 4 years experience
Master's degree + 3+ years
PhD + 2+ years

Tools

Packaging processes
Equipment automation development
Project management

Job description

Job Details:
Job Description:

About the Role

Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection , where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes.

You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.

What You’ll Do

Key responsibilities will include but not limited to:

  • Develop and implement defect inspection and metrology technologiesfor semiconductor manufacturing.
  • Design and optimize processes, inspection methods, and equipment performance.
  • Conduct process experimentation and feasibility studiesusing statistical and engineering methods (DOE, SPC).
  • Collaborate with equipment and materials suppliersto introduce new technologies.
  • Analyze defect data to identify root causes and improve yield and quality.
  • Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
  • Support technology pathfinding and roadmap developmentfor next-generation products.
  • Stay current with industry trends, emerging tools, and inspection methodologies.

Behavioral traits that we are looking for candidates who:

  • Collaborate effectivelyacross teams and disciplines
  • Show curiosity and continuous learning mindset
  • Demonstrate strong analytical and problem-solving skills
  • Can adapt to changing priorities in a dynamic environment
  • Communicate technical concepts clearly to diverse audiences
  • Take ownership and accountabilityfor results
  • Drive innovation while maintaining attention to detail

Why Join Us

  • Work on cutting-edge semiconductor technologies
  • Opportunity to influence high-volume manufacturing and future nodes
  • Collaborative, inclusive, and innovation-driven environment
  • Career growth through challenging technical opportunities
  • Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
    • See Intel Benefitsfor more details.
Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Note:

For information on Intel’s immigration sponsorship guidelines, please see

Intel U.S. Immigration Sponsorship Information

Minimum Qualifications and Experience :

Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience. Or a Master’s degree in the same field with 3+ years of experience and a PhD in the same field with 2+ years of experience.

Your experience described above must be in the following:

  • Semiconductor processing, system controls, opto-mechanics, or mechanical systems.
  • Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Preferred Qualifications and Experience :

  • Demonstrated ability to troubleshoot manufacturing processes and equipment.
  • Experience with packaging processes, equipment automation development, or project management in technology development.
  • Previous related work experience in a semiconductor foundry preferred
Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:
Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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