Module Development Engineer

Intel; Hillsboro (AL); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health plan

Vacation

Job summary

Intel in Hillsboro, Oregon, seeks a CMP Process Development Engineer to advance planarization techniques for diverse materials, enabling rapid IC miniaturization and high-volume production. You will work in Intel's Logic Technology Development with a strong emphasis on cross-disciplinary collaboration and process integration.

The role requires a PhD in a semiconductor-related field and hands-on experimental research, plus experience in data analysis, DOE, and equipment optimization.

Qualifications

• PhD required in a semiconductor-related STEM field with hands-on experimental research.
• Strong background in statistics, DOE, SPC and engineering analysis tools.
• Familiarity with semiconductor device physics and process integration is preferred.

Responsibilities

• Drives technology development and enablement for high volume manufacturing and future tech.
• Leads design of sophisticated manufacturing processes and repair reverse engineering.
• Recommends equipment modifications to improve production efficiency and output.
• Partner with suppliers to develop enabling elements of the technology.
• Performs feasibility studies and develops roadmaps for future technologies.

Skills

Data analysis

Experimental lab work

Semiconductor device physics

Statistical analysis

Education

PhD in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry, CS

Tools

MATLAB

Excel

JMP

Job description

Job Details:

Job Description:

Join Intel - and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Join us and help us create the next generation of technologies that will shape the future for decades to come.

Engineers within Intel's Logic Technology Development (LTD) organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century. We innovate leading edge fabrication processes and continue to overcome seemingly impossible barriers as tolerances and specifications for building best-in-class computing devices become increasingly rigorous.

The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and architectures, enabling rapid miniaturization in the semiconductor industry and the mass production of integrated circuits. CMP techniques leverage physics, chemistry, materials science and surface science concepts, and exist at the intersection of these disciplines. As a result, our team has a diverse set of scientific backgrounds that relies on strong collaboration and shared learning.

The role’s responsibilities include, but are not limited to:

• Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications

• Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements

• Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap

• Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products

• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology

• Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods

• Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap

Qualifications:

You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM (Science Technology Engineering Math) field of study (with a focus on hands-on experimental research).

Preferred Qualifications:

• Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools

• Experimental lab work

• Semiconductor and transistor device physics

• Advanced transistor device structures and architectures including fabrication (e.g., lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.) with in-depth knowledge of semiconductor device physics and process integration

• Data analysis skills with demonstrated ability to construct clear data-based problem statements

• Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.)

• Design of experiments

• Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing

• Statistical, data analysis (MATLAB, Excel, JMP, etc.)

• Must be able to start within 12 months

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.